Organic semiconductors are very promising candidates as starting materials for the manufacture of cheap, large area and flexible electronic components such as transistors, diodes and sensors on a scale ranging from micro to nano.
Embarking on a new era of microcontroller (MCU) leadership, Freescale Semiconductor today announced the Kinetis family of 90 nanometer (nm) 32-bit MCUs based on the new ARM® Cortex-M4 processor.
MunEDA's tool suite WiCkeD(TM) has been validated for TSMC’s RF Reference Design Kit (RDK) 2.0 as part of the TSMC Open Innovation Platform(TM). WiCkeD covers a wide range of topic in interactive and automatic specification-driven custom circuit design, including design centering, circuit sizing for performance and yield, performance analysis, statistical circuit analysis.
Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), today announced that Technology Leaders & Innovators (TLi), a leading fabless developer of display semiconductor products, has selected the AFS Platform for full-circuit verification and device noise analysis of its complex mixed-signal ICs for display applications.
MOSIS, CMP and CMC are partnering to offer a 3D-IC Multi-Project Wafer (MPW) service based on Tezzaron Semiconductor's SuperContact technology and GLOBALFOUNDRIES' 130nm CMOS process.
The first MPW run is t...
What could be better than diamond when it comes to a superhard material for electronics under extreme thermal and pressure conditions? Quite possibly BC5, a diamond-like material with an extremely high boron content...
As cell phones and computers continue to shrink, many companies are seeking better ways to store hundreds of gigabytes of data in small, low-power devices.
Cambridge NanoTech, the world leader in Atomic Layer Deposition (ALD) science and equipment, today announced the delivery of its 200th ALD system.
Alchimer S.A., a leading provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV), today announced a groundbreaking advance for filling narrow, high-aspect-ratio TSVs while significantly reducing the need for chemical components in the metallization process.
Key executives of Bayer MaterialScience and the Singapore Economic Development Board officially opened today the company's new Functional Films Research Centre. The full-scale facility for upstream research will focus on coated high-tech films and nanotechnology to meet the ever-evolving and growing demand of the electronics market in Asia Pacific.
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