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Elpida Collaborates with PTI, UMC to Advance 28nm 3D IC Integration Technologies

Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation, today announced their entry into a 3-way cooperation to advance 3D IC integration technologies for advanced processes includin...

21 Jun 2010

Synopsys Introduces Galaxy Characterization Solution

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today introduced its Galaxy Characterization Solution.

From Synopsys, Inc. 18 Jun 2010

Mentor Graphics Supports TSMC's New 28nm AMS Reference Flow

Mentor Graphics Corporation today announced corporate-wide support for TSMC's new Analog/Mixed-Signal (AMS) Reference Flow 1.0, including analog IC simulation, physical and electrical verification, high-accuracy extraction and design for manufacturing (DFM).

18 Jun 2010

Graphene Producer Vorbeck Honored in New York Venture Summit

Graphene leader Vorbeck Materials is pleased to announce that it has been selected as a winner of the Top Innovator Award by the annual New York Venture Summit. The award recognizes cutting edge private companies driving the future of innovation.

From Vorbeck Materials 18 Jun 2010

Rapid Evolution of Technologies Help Flexible Display Market Expansion

Research and Markets (http://www.researchandmarkets.com/research/b8a819/global_flexible_di) has announced the addition of the "Global Flexible Display Market 2009 2013" report to their offering. Flexible Di...

18 Jun 2010

TSMC Unveils New Slim Library Targeting 65nm LP Process

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today introduced the first Slim Library that reduces system-on-chip (SoC) routed logic block area by 15 percent compared to blocks routed thro...

From TSMC Taiwan Semiconductor Manufacturing Company 18 Jun 2010

Macronix Paper on 3D NAND Flash Chosen for 2010 VLSI Technology Symposium

Macronix International Co., Ltd. (TSE: 2337), a leading provider of non-volatile memory semiconductor solutions, today announced its research results that provide a successful path to the most scalable and most efficient 3D NAND Flash using its patented BE- SONOS (barrier engineering) charge-trapping technology and 3D decoding architecture.

18 Jun 2010

Synopsys Launches Rapid3D Technology for Sub-45nm Custom IC Designers

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today unveiled Rapid3D technology, a new 3D fast field solver engine fully integrated into Synopsys' StarRC™ Custom parasitic extraction solution.

From Synopsys, Inc. 17 Jun 2010

TSMC Validates Magma's Solutions for 28-nm AMS Reference Flow 1.0

Magma® Design Automation, a provider of chip design software, today announced TSMC has validated the Titan™ Mixed-Signal Design Platform and FineSim™ SPICE and FineSim Pro circuit simulation products for TSMC's first Analog/Mixed-Signal (AMS) Reference Flow inclusion, targeting its most advanced 28-nanometer (nm) process technology.

17 Jun 2010

Synopsys Supports HKMG 32, 28-nm Technology by Offering Optimized Design Environment

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced it is delivering an optimized, pre-validated design environment for the Common Platform alliance (CPA) 32/28-nanometer(nm) high-k metal gate (HKMG) technology based on Synopsys' Lynx Design System.

From Synopsys, Inc. 17 Jun 2010