Nanoelectronics News

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X-FAB Introduces Cost-Efficient 180nm SOI Technology for Automotive, Industrial Applications

X-FAB Silicon Foundries, the leading More than Moore foundry, today announced the industry? first cost-efficient 180nm SOI technology for automotive and industrial applications that need to operate in harsh environments.

26 Jun 2015

Better Understanding of How Heat is Transported through Nanometer-Scale Materials

A growing interest in thermoelectric materials ?which convert waste heat to electricity ?and pressure to improve heat transfer from increasingly powerful microelectronic devices have led to improved theoretical and experimental understanding of how heat is transported through nanometer-scale materials.

25 Jun 2015

Cadence, Applied Materials Collaborate to Optimize CMP Process for Advanced-Node 14nm Designs

Cadence Design Systems, Inc. and Applied Materials, Inc. today announced the companies are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nanometer (nm) and below.

From Cadence Design Systems 23 Jun 2015

Inkjet Technology for Printing Electronic Nanomaterials onto Flexible Substrates

Researchers at Binghamton University are focusing on printed electronics: using inkjet technology to print electronic nanomaterials onto flexible substrates. When compared to traditional methods used in microelectronics fabrication, the new technology conserves material and is more environmentally friendly.

23 Jun 2015

Quantum Effect Found in Atomically Thin Diode

Researchers at Penn State, UT-Dallas, Institute of Atomic and Molecular Sciences, and King Abdullah University of Science and Technology, have found that a novel quantum mechanical transport phenomenon demonstrated at room temperature in an atomically thin layered material could help develop new nanoelectronic devices and circuits.

23 Jun 2015

UMC and ARM Collaborate to Tape out PQV Test Chip on 14nm FinFET Technology

United Microelectronics Corporation, a leading global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node. The 14nm cooperation expands on the two companies' successful effort to develop and offer ARM Artisan® Physical IP on UMC's volume production 28nm High-K/Metal Gate process.

22 Jun 2015

UMC, Synopsys Collaborate to Develop Second UMC 14nm Process Qualification Vehicle

Synopsys, Inc. and United Microelectronics Corporation today announced an expanded collaboration to include Synopsys DesignWare® Embedded Memory IP and the DesignWare STAR Memory System® test and repair solution on UMC's second 14-nanometer (nm) FinFET process qualification vehicle (PQV).

From Synopsys, Inc. 22 Jun 2015

Webinar: Enabling Wide Band Gap Power Semiconductor Devices to Deliver Energy Efficiency Savings

Oxford Instruments Plasma Technology announce webinar on process solutions for GaN and SiC power semiconductor devices, 8th July 2015.

17 Jun 2015

Stretchable, Transparent Conductors with Nano-Accordion Design for Flexible Electronics Applications

North Carolina State University researchers have developed flexible, transparent conductors with “nano-accordion” design. The conductors hold promise in different applications including wearable sensors, stretchable displays or flexible electronics.

From North Carolina State University 17 Jun 2015

KAIST Develops Flexible PRAM Enabled By Self-Assembled BCP Silica Nanostructures

Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics. In order to be used as a core memory for flexible devices, the most important issue is reducing high operating current. The effective solution is to decrease cell size in sub-micron region as in commercialized conventional PRAM. However, the scaling to nano-dimension on flexible substrates is extremely difficult due to soft nature and photolithographic limits on plastics, thus practical flexible PRAM has not been realized yet.

16 Jun 2015

Nanoelectronics News

X-FAB Introduces Cost-Efficient 180nm SOI Technology for Automotive, Industrial Applications

Better Understanding of How Heat is Transported through Nanometer-Scale Materials

Cadence, Applied Materials Collaborate to Optimize CMP Process for Advanced-Node 14nm Designs

Inkjet Technology for Printing Electronic Nanomaterials onto Flexible Substrates

Quantum Effect Found in Atomically Thin Diode

UMC and ARM Collaborate to Tape out PQV Test Chip on 14nm FinFET Technology

UMC, Synopsys Collaborate to Develop Second UMC 14nm Process Qualification Vehicle

Webinar: Enabling Wide Band Gap Power Semiconductor Devices to Deliver Energy Efficiency Savings

Stretchable, Transparent Conductors with Nano-Accordion Design for Flexible Electronics Applications

KAIST Develops Flexible PRAM Enabled By Self-Assembled BCP Silica Nanostructures

New Study Finds Electrons Flow Like Liquid in Graphene, Breaking Rules

Research Boosts Graphene’s Potential to Unprecedented Heights

Novel 3D Imaging Technique Captures In Situ Nanoparticle Self-Assembly

Orange Peel Nanoparticles: New Green Synthesis

Sugar-Coated Nanoparticles Boost Cancer Drug Efficacy

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

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