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UT Dallas and UC Berkeley Professors Recognized for Contributions to Semiconductor Research

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design – in consultation with Semiconductor Research Corporation (SRC) – today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.

14 Nov 2014

Researchers Receive Grant to Further Develop New Material for Advanced Electronics

Engineering researchers at the University of Arkansas and their colleague at the University of Arkansas at Pine Bluff have received a $725,000 grant from the U.S. Air Force Office of Scientific Research to further develop a new material for advanced electronics devices.

14 Nov 2014

Forecast Report on Global Market for Flexible, Printed and Thin Film Batteries

Research and Markets has announced the addition of the "Flexible, Printed and Thin Film Batteries 2015-2025: Technologies, Forecasts, Players" report to their offering.

From Research and Markets 14 Nov 2014

TSMC Announces 16nm FinFET Plus Process in Risk Production

TSMC today announced its 16-nanometer FinFET Plus (16FF+) process is now in risk production. This enhanced version of TSMC's 16FF process operates 40% faster than the company's planar 20-nanometer system-on-chip (20SoC) process, or consumes 50% less power at the same speed. It offers customers a new level of performance and power optimization targeted at the next generation of high-end mobile, computing, networking, and consumer applications.

13 Nov 2014

Forecast Report on Global Markets for Stretchable Electrics and Electronics

Stretchable electronics concerns electrical and electronic circuits and combinations of these that are elastically or inelastically stretchable by more than a few percent while retaining function.

12 Nov 2014

Applied Materials Announces Collaboration to Develop Advanced Patterning Solution for Memory Devices

Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

From Applied Materials Inc. 11 Nov 2014

Energy Control Principles for Durable and Cheap Nano-Devices

Large quantities of energy are wasted by the electronic devices in the form of heat. This is the reason behind the consumption of excess battery power by mobile phones.

7 Nov 2014

INVECAS to Operate SoC Design Service Centers to Provide Support for GLOBALFOUNDRIES Customers

GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing, design and technology solutions, today announced a partnership with INVECAS Inc., a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies.

7 Nov 2014

ProPlus Design Solutions Releases Re-Innovated BSIMProPlus SPICE Modeling Platform for Nanometer Devices

ProPlus Design Solutions Inc., the SPICE modeling solutions leader and provider of the first giga-scale SPICE simulator and unique Design-for-Yield (DFY) solutions, today introduced the latest release (2014.2) of the re-innovated BSIMProPlus™, the leading SPICE modeling platform for nanometer devices.

From ProPlus Design Solutions, Inc. 6 Nov 2014

Xilinx Introduces 20nm DSP-Optimized Kintex UltraScale KU115 FPGA

Xilinx, Inc. today announced the expansion of its 20 nm portfolio with shipment of the Kintex® UltraScale™ KU115 FPGA. As the flagship of the Kintex UltraScale family, the KU115 offers the highest DSP count available in a single programmable device, doubling the DSP resources previously available. This DSP-optimized KU115 FPGA targets data center compute acceleration and signal processing applications including data center, video and medical imaging, broadcast systems, and radar.

5 Nov 2014