Posted in | Nanoanalysis

EV Group Declares CEA-Leti Has Incorporated EVG Tools in its 300mm Clean-Room

EV Group recently declared that CEA-Leti has incorporated multiple EVG tools in its 300mm clean-room for research and development and developing three-dimensional integration applications.

The facility will use EVG equipment to develop technology for mass production of three-dimensional applications and small scale manufacture of 300mm wafers processes suitable for mass production environments.

CEA-Leti will utilize an IQ Aligner production mask system, a SmartView NT precision bond alignment system, an EVG560 production wafer bonding system and an EVG850 production bonding system for direct wafer bonding applications. CEA-Leti will exploit EVG's process know-how in 3D integration and in through-silicon via (TSV) production.

EVG collaborates with research groups and institutions including CEA-Leti and global consortia like EMC-3D, an organization focusing on reducing three-dimensional chip costs, SEMI, NILCOM, a Consortium for Commercialization of Nanoimprint Lithography, NIL Austria, and Mancef (Micro and Nanotechnology Commercialization Education Foundation). According to market analyst Frost & Sullivan, these endeavors help reduce research and development in technology development costs. The market analyst recently honored EVG with its 2010 Europe Product Innovation Award in Nanoimprint Technology.


Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback