Rudolph Technologies Ships 1000th Wafer-Level Packaging Inspection System

Rudolph Technologies has announced the shipment of the 1000th NSX Inspection System, its wafer-level packaging inspection system from its production facility located in Bloomington, Minnesota.

NSX 320 System

August Technology based in Minnesota introduced the NSX-80 inspection system in 1997. The system soon attracted the interest of major chipmakers in the industry due to its advantages over manual inspection. The company sold its 100th NSX System in August 2000 and strengthened its foothold in automated macro inspection.

In 2006, August Technology and Rudolph Technologies merged and the newly formed company has introduced new NSX models to fulfill the growing demands of complicated inspection requirements of semiconductor mass producers in the back-end packaging field.

Every new NSX model has been engineered to constantly decrease production costs, while enhancing production outputs by providing new functionalities to monitor LED wafers, MEMS devices, microbumps and wafer-level packaging.

Rudolph Technologies secured the first order for its NSX 320 Inspection System, the latest member of the NSX portfolio, in June 2011. The NSX 320 System, a result of the company’s vast experience and research and development capabilities, has been upgraded for sophisticated packaging processes that employ through silicon vias to link several die in one package.

According to Gartner Dataquest, Rudolph Technologies is the market leader in semiconductor wafer-level packaging inspection since 2005 due to the wide usage of its NSX System as well as its wafer scanner inspection system to its back-end family.


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