FlipChip International, (FCI), the global technology leader in flip-chip bumping and wafer level packaging, announced today a partnership alliance with Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI and SEHK: 0981.HK), the largest, most advanced semiconductor foundry in China, for 300mm flip chip bumping and wafer level packaging.
Under this strategic partnership, FCI and SMIC will jointly promote SMIC's advanced 300mm bumping fab in Shanghai's Pudong district. FCI's participation will be through its joint venture, FlipChip Millennium (Shanghai) (FCMS), and the FCI facility in Phoenix, Arizona, offering turnkey bumping services.
The two companies will also align their technology and product roadmaps for 300mm bumping solutions at a number of technology nodes, including those required for next generation packaging such as 3D packaging and embedded die applications. Next generation packaging can be utilized in mobile handsets, medical devices, automotive integrated circuits, microprocessors, graphics processors, and wireless 3G integrated solutions.
"This outstanding strategic partnership confirms the strong relationship between two internationally recognized semiconductor providers and also validates the global strategic importance of wafer level packaging and flip chip bumping for next generation products, including 3G mobile handsets," said Bob Forcier, FCI President and CEO. "This alliance will provide the market with the most complete global bumping and wafer level packaging service in the industry."
Chiou Feng Chen, SMIC Vice President of Corporate Marketing and Sales, said, "We are excited to form this partnership alliance with FCI, which combines two robust product portfolios to provide the most comprehensive bumping solution available in the market today. In addition, the alliance offers customers the potential of a one-stop solution for wafer fabrication, bumping, probe and final test, and drop-ship service to end customers."