Report Examines Integrated Circuit Advanced Packaging Industry

Research and Markets, the leading source for international market research and market data, has announced the addition of the "IC Advanced Packaging Industry Report, 2009" report to their offering.

The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019. Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm SoC costs USD75-120 million, while it is less than USD5 million for 130nm. Therefore, even if the IC design companies with annual revenue of over USD2 billion probably can not afford such high cost, and there are no more than ten such companies all over the world, which means that the majority of IC design companies are disqualified to enter 45nm or 32nm era. Perhaps the semiconductor industry will develop at the pace of Moore's Law. Having made up for the bottleneck of process shrinkage, the packaging industry will yield unusually brilliant results in post-Moore's Law era.

In practice, the packaging industry has become increasingly important since 2000, and the debut of BGA, FC and CSP has sped up the progression of semiconductor industry. However, the front-end of semiconductor manufacturing has been in stagnancy, still in the era of 12-inch wafer, and it is likely that 15-inch wafer era will not come. Currently, a revolutionary packaging, TSV packaging presents itself, which is so called 3D IC. The technology will dramatically improve chip transistor density, cubic density rather than plane density, and make semiconductor industry surpass the development pace of Moore's Law. Not only packaging companies and wafer OEMs, but also nearly all global prominent semiconductor companies such as IBM, Samsung, Intel and Qualcomm are all actively developing TSV technology. TSV has been in large shipment in image sensor and MEMS field, and it will rapidly expand to memory field in the future, and to DSP, RF IC, cell phone baseband, processor, CPU and GPU in 2013. Furthermore, TSV market size will rise to over US$2 billion from less than US$ 300 million currently, which will be the rapidest growing field in semiconductor industry.

In the meantime, the advanced packaging has an increasingly powerful driving force. IC advanced packaging mainly refers to IC substrate packaging, including BGA, CSP, FC and LGA, and it mainly applies for cell phone, memory, PC (CPU, GPU and Chipest), network communications, and consumer electronics. In addition, the network communications include high-speed switch, router and base station. Consumer electronics are as the followings such as game console, IPOD, ITOUCH, and high-end PMP. The cell phone has more and more powerful functions, thinner and thinner in size; and the smart phones have covered a rising ratio. In the field of memory, DDR3 has become the mainstream, with the rate increased to over 1GHz; CPU has multi-cores, and the number of pins has exceeded 1,200. China's 3G and the world's 4G network distribution has boosted up the sales of base stations. The stay-at-home economy has made game machine shipment increase sharply as well.

Japan and Taiwan have almost dominated IC packaging industry.

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Research and Markets. (2019, March 18). Report Examines Integrated Circuit Advanced Packaging Industry. AZoNano. Retrieved on March 03, 2024 from https://www.azonano.com/news.aspx?newsID=14413.

  • MLA

    Research and Markets. "Report Examines Integrated Circuit Advanced Packaging Industry". AZoNano. 03 March 2024. <https://www.azonano.com/news.aspx?newsID=14413>.

  • Chicago

    Research and Markets. "Report Examines Integrated Circuit Advanced Packaging Industry". AZoNano. https://www.azonano.com/news.aspx?newsID=14413. (accessed March 03, 2024).

  • Harvard

    Research and Markets. 2019. Report Examines Integrated Circuit Advanced Packaging Industry. AZoNano, viewed 03 March 2024, https://www.azonano.com/news.aspx?newsID=14413.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit
Azthena logo

AZoM.com powered by Azthena AI

Your AI Assistant finding answers from trusted AZoM content

Your AI Powered Scientific Assistant

Hi, I'm Azthena, you can trust me to find commercial scientific answers from AZoNetwork.com.

A few things you need to know before we start. Please read and accept to continue.

  • Use of “Azthena” is subject to the terms and conditions of use as set out by OpenAI.
  • Content provided on any AZoNetwork sites are subject to the site Terms & Conditions and Privacy Policy.
  • Large Language Models can make mistakes. Consider checking important information.

Great. Ask your question.

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.