Life BioScience, Inc. (LBSI) has received a grant totaling $150,000 from the National Science Foundation (NSF) for further development of its proprietary glass ceramic platform for next generation electronic packaging substrates.
These novel substrates will integrate a number of enhancements into a single substrate that includes high density copper interconnects, high pressure microfluidics for thermal management requirements and optical waveguide systems.
Over the last decade, packaging was considered a secondary issue after integrated circuit development, but increasing costs and substrate material limitations have brought it to the forefront. This NSF project directly addresses these cost and material constraints. The current market for traditional electronics packaging exceeds $6B a year, but is facing extreme performance and environmental challenges.
"There is a significant need for advancements in electronics packaging to meet the requirements for electronics systems of the future, in both commercial and military applications," said Blake Ridgeway, LBSI President and CEO. "The superior performance of our glass ceramic substrate is expected to meet these future requirements in a shorter timeline than what is currently projected by the electronics industry."
LBSI's research is being conducted in its offices in Albuquerque, NM. This funding is part of the federal government's Small Business Innovative Research (SBIR) program.