CHAD Develops Tooling Options to Handle Smaller Sapphire Wafers

CHAD Industries announced today that it has developed wafer-handling capabilities for Sapphire wafers used in the LED market.

As production demand increases for LED production, more and more OEM manufacturers are being asked by the end user to provide fully automated solutions for their process tool. CHAD has adapted the standard WaferMate200 workcell to handle the smaller 2”, 4”, and 6” sapphire wafer requirements.

“We have developed a standard suite of tooling options to permit a wide range of LED applications using our standard WaferMate200 platform,” says Scott Klimczak – President of CHAD Industries. “This is another example where CHAD can provide all of the customization so that our customer’s OEM process tool can remain standard. This approach allows our OEM customers in the LED market to concentrate on their core competency (the process tool), and allows CHAD to concentrate on our core competence (wafer automation).”

CHAD’s capabilities for handling smaller sapphire wafers was exhibited in their booth at the recent SemiconWest show in San Francisco in July. CHAD’s WaferMate200 workcell was tooled to handle 2” sapphire wafers and was loading and unloading a Veeco Instruments Inc. 3D non-contact ContourGT-X8 inspection tool during a live demonstration.

The CHAD LED wafer handling solutions can be applied to process tools at different stages of manufacture and for different types of manufacture – including metrology inspection and measurement, stud bumping, and solder bumping.


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