Feb 23 2011
DCG Systems, Inc. today announced that it has been awarded multiple development contracts funded by the Intelligence Advanced Research Projects Activity (IARPA).
The contracts total over $17 million and are intended to expedite the research and development of innovative technologies and tools for fault isolation and logic analysis on 11 nm IC process technologies. Funding for these contracts is on a yearly basis, extending over four years.
DCG is recognized as the technology leader in the areas of design debug, failure analysis and electrical fault isolation. Leading edge semiconductor design analysis tools play a very crucial role in ensuring the reliability of advanced technologies, therefore government funding is critical in stimulating the necessary innovation.
"The funding from these IARPA projects is aimed at extending the technological boundaries and ultimately benefits the semiconductor market in a significant way," said Dr. Israel Niv, President and CEO of DCG Systems. "This is a needed source of R&D funding, without which the proposed innovations would not be investigated in the near term, and will provide technologies needed to address future IC processes."
The awarded contracts include the development of a logic analysis tool to investigate the functional testing of the IC logic, including timing of individual transistors and the development of a two-photon Laser Assisted Device Alteration (LADA) tool for fault isolation. To develop these new tools, new Solid Immersion Lens (SIL) based technologies are needed as well as new photon detectors. In these projects, DCG collaborates with a team of respected contributors in each area which includes MIT, Photon Spot, Boston University, Hypervision Solutions, Heriot-Watt University and two major semiconductor manufacturers.
Source: http://www.dcgsystems.com/