CHAD Industries has declared that it has completed the installation of several completely automated bond shear inspection workcells for its 300 mm wafer applications.
CHAD Industries has integrated its standard automated wafer handling workcell called WaferMate300-1 with the 4300 bond shear inspection equipment of Nordson DAGE so as to fulfill the requirement for hands-free handling and bond shear study of 300 mm wafers.
The outcome of this combination is a completely integrated system that is capable of delivering 300 mm wafers automatically to the bond shear test equipment. The whole system is covered for ensuring safety of operators and Class-2 clean wafer handling, as well as comprises factory automation features such as E87 and E84 for delivering FOUP automatically to the workcell.
Integrated RFID features and SECS/GEM communications assure the inspection of the correct wafer batch as well as the hands-free uploading of the wafer inspection data to the computer housed in the factory.
CHAD Industries’ President, Scott Klimczak stated that the company cooperated with Nordson DAGE, its OEM partner, in order to meet its customers’ requirement for a completely automated bond shear inspection tool for 300 mm wafers. The company was able to adapt and closely integrate Nordson DAGE’s 4300 bond shear inspection equipment with its WaferMate300-1 automated wafer handler. It is an illustration to the company’s ability to provide value-added, completely integrated automation systems to its OEM partners for the installation of its current and new technologies globally, he added.