Oct 8 2015
3M has entered into a licensing agreement with Lotus Applied Technology to access Lotus’s TransFlexALDTM spatial Atomic Layer Deposition (ALD) and barrier materials patent portfolio.
TransFlexALD technology enables high-speed, low-cost deposition of single layer “ultra-barrier” coatings on rolls of polymer film using ALD. These coatings play a critical role in the encapsulation of moisture- and oxygen-sensitive electronics, such as OLED (organic light emitting device) lighting and displays, quantum dot films, photovoltaics, and flexible electronics.
“We are pleased to partner with Lotus AT and for the potential of their ALD technology to expand our ultra barrier film solutions portfolio as we integrate it with 3M’s proven technology strengths,” said John Banovetz, vice president of 3M’s Corporate Research Laboratory. “This licensing agreement and our continued product innovation will help 3M increase the performance of our ultra barrier films and offer cost-effective barrier solutions that will allow our customers to provide more competitive products in the flexible electronics markets they serve.”
3M is a leading manufacturer of flexible, transparent ultra barrier films providing encapsulation solutions for display (3M™ Flexible Transparent Barrier Film) and other sensitive electronic applications.
“We are excited to partner with 3M, a distinguished technology leader in the field of ultra barrier films,” said Eric Dickey, president of Lotus Applied Technology. “This technology offers the opportunity to radically improve the performance of single-layer barrier coatings, and 3M’s experience and expertise in this field will enable its rapid deployment in a field of applications that have been demanding higher performance at lower cost.”
Source: http://www.3m.com/