Nanometrics Incorporated, a leading provider of advanced process control systems, today announced the launch of IMPULSE®+, its latest system for integrated process control enabling both optical critical dimension (OCD) and thin film metrology. The IMPULSE+ has already been deployed for high-volume manufacturing of second-generation 3D-NAND as well as development of third-generation devices.
“Many of our customers have traditionally relied upon thin film measurements for chemical mechanical polish (CMP) control, and are now migrating to OCD technology for better correlation to device performance and yield,” commented Dr. Srini Vedula, vice president of OCD/Thin Film Solutions at Nanometrics. “Beginning with our 3D-NAND launch partner, the enhanced performance and features of the IMPULSE+ have driven rapid adoption, acceptance and deployment by multiple customers. With best-in-class deep-ultraviolet (DUV) optics and improvements in productivity, IMPULSE+ offers both maximum sensitivity and accuracy to detect CMP process excursions. Additionally, our existing customer investments in process equipment and metrology can be extended by enabling seamless field upgrades from IMPULSE to IMPULSE+.”
The IMPULSE+ works in conjunction with Nanometrics’ NanoDiffract® software suite, for critical dimension modeling and control as well as part of a larger fleet of IMPULSE, Trajectory™ T3, and Atlas® family of systems to provide comprehensive fab-wide control. Nanometrics is the industry pioneer in integrated metrology with the broadest suite of offerings qualified on platforms for CMP, deposition, lithography track and etch systems. The IMPULSE+ can be deployed across key steps in DRAM, 3D-NAND, CMOS image sensor, and foundry/logic devices.