Jul 15 2008
At Semicon West 2008, SUSS MicroTec unveils the second generation of its MA300 Production Mask Aligner featuring a dedicated alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging. High alignment accuracy is required to enable 3D applications ranging from latest-generation mobile consumer electronics to supercomputers.
The new 3D-Alignment platform enables bottom side and infrared alignment for 300mm based three-dimensional (3D) packaging lithography applications, thereby enabling cost effective mask aligner systems to meet the most aggressive technology roadmaps for thick resist applications and keep costs low relative to 1X Stepper lithography solutions.
While bottom-side alignment enables SUSS 300mm Mask Aligners to process double-sided structured wafers, the infrared alignment option allows the handling of opaque, yet IR-transparent materials such as adhesives, in particular for thin wafer handling or encapsulation applications. Both alignment techniques have become critically important for 3D interconnect applications such as etch masks for Through Silicon Vias and dicing streets, backside redistribution layers (RDLs) or bumping applications.
Rolf Wolf, general manager for SUSS MicroTec’s lithography division said: “The unique 3D technology enhancement for the MA300 mask aligner provides our customers with best-in-class equipment performance that enables them to meet the increasing challenges for 3D interconnect applications.”