Article - 7 Jan 2004
The Dow Chemical Company has introduced an advanced porous SiLK semiconductor dielectric resin with a significantly reduced pore size, enabling continuous physical-vapour-deposited (PVD) tantalum...
News - 26 Jun 2008
Materials scientists at the National Institute of Standards and Technology (NIST) have developed a process to build complex, three-dimensional nanoscale structures of magnetic materials such as nickel...
News - 11 Jun 2013
Alchimer, S.A., a leading provider of wet deposition technologies for dual damascene, through-siliconvias (TSVs), MEMS and solar, today announced a joint development project with imec to evaluate and...
News - 15 Jul 2011
Replisaurus Technologies and CEA-Leti have jointly taken an important step to start commercializing the new Replisaurus’s ElectroChemical Pattern Replication (ECPRTM) metallization...
News - 29 Oct 2011
ACM Research Shanghai has unveiled the integrated Ultra iSFP, its latest semiconductor production tool that delivers zero-damage 45 to 65 nm copper interlink stress free polishing (SFP).
News - 11 May 2009
Rudolph Technologies, Inc. (Nasdaq: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the availability of its new...
News - 9 Apr 2009
Since the advent of copper damascene processing, achieving void-free fill of high aspect ratio interconnect features has been a key challenge for device manufacturers. Shrinking dimensions at each...
News - 14 Jul 2009
IMEC presents innovations in dielectrics and metallization technologies as well as in their integration approaches. Great progress has been obtained in the metallization of 22nm interconnects, in...
Article - 4 Mar 2011
This report effectively demonstrates the ability of the FlexAFM to monitor morphological changes during electrodeposition of material on an electrode surface.
News - 31 May 2012
Ziptronix, whose trademark Direct Bond Interconnect (DBI) technology facilitates reduction in footprint and the size of devices with 3D architecture, has announced its collaboration with a new...