Molecular Imprints, a provider of high-resolution nanopatterning systems and solutions, has secured a purchase order from a major semiconductor equipment company to procure multiple imprint modules for integration into its stepper systems.
SPTS Technologies, the company that provides wafer processing solutions globally for semiconductor packaging, MEMS, power management device markets and such related markets, has introduced a low temperature plasma-enhanced chemical vapour deposition (PECVD) solution that addresses the issues in via-reveal passivation or post-through silicon via (TSV) processing in packaging of 3D integrated circuits.
Carl Zeiss Microscopy introduced the ORION NanoFab at the European Microscopy Congress (EMC) in Manchester, UK. It is the first multi-ion-beam tool based on Gas Field Ion Source (GFIS) technology, offering interchangeable gallium, neon and helium ion beams.
SEMATECH, an international semiconductor association that endeavors to advance semiconductor chip manufacturing through research and development activities, recently reported a significant breakthrough in defect reduction from the multi-layer deposition technique adopted to process mask blanks that have applications in extreme ultra violet lithography (EUVL).
A consortium based in Tampere University of Technology (TUT) has received €1.6 million grant from the Academy of Finland under its ‘Programmable Materials’ funding scheme.
Veeco Instruments, a provider of equipment solutions for production of wireless chips, MEMS, hard drives, power electronics and LEDs, has reported the delivery of its TurboDisc K465i MOCVD system to Nantong Tongfang Semiconductor’s new LED Technology Center located in Nantong, China.
While two-dimensional patterns can be recreated fairly well with techniques like microlithography, three-dimensional structures represent a big challenge. In the journal Angewandte Chemie, American researchers have now reported a new method for the lithography-free etching of complex surface motifs with the use of biodegradable polymers and enzymes.
SPTS, the company that designs, manufactures and supplies etching solutions for the semiconductor industry, has launched the Pegasus Rapier module, which is a dry etch process tool for via reveal processes.
Entegris has launched a new 10 nm liquid filter labeled the Intercept HPM Liquid Filter which is the latest innovation in its line of sophisticated filter solutions and find applications in exacting semiconductor manufacturing processes.
DCG Systems, a company that provides solutions for characterization, diagnosis and defect localization of semiconductor circuits, has been awarded a multimillion dollar contract to supply its new generation OptiFIB Viper system that facilitates 20 nm circuit technologies to a renowned manufacturer of integrated devices (IDM).
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