Nanofabrication News

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STMicroelectronics Utilizes IC Compiler II to Tape Out Complex 28nm-FD-SOI SoC

Synopsys, Inc. today announced STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has taped out their latest fully depleted silicon on insulator (FD-SOI) system on chip (SoC) using Synopsys' IC Compiler™ II place and route solution.

From Synopsys, Inc. 2 Jun 2015

Mild Carbonization Process Converts Polymer Organic Frameworks into Nanometer-Thick Carbon Sheets

Stanford University scientists have created a new carbon material that significantly boosts the performance of energy-storage technologies. Their results are featured on the cover of the journal ACS Central Science.

30 May 2015

ANSYS Software Receives TowerJazz Certification for 80nm PDKs and Reference Design Flow

ANSYS, Inc. and TowerJazz, a leader in specialty foundry technology, are working to meet the growing demands for automotive, medical and Internet of Things (IoT) applications where product reliability and robustness are paramount. This collaboration has enabled TowerJazz to certify ANSYS® Totem™ and ANSYS® PathFinder™ software for its 180-nanometer (nm) process family design kits (PDKs) and reference design flow.

29 May 2015

Ceapro to Scale-Up PGX Technology for Processing Biopolymers into Bio-Nanocomposites

Ceapro Inc. ("Ceapro" or the "Company"), a growth-stage biotechnology company focused on the development and commercialization of active ingredients for the healthcare and cosmetic industries, announced today it will embark on a scale-up of its proprietary PGX technology to commercial and demonstration levels.

29 May 2015

Xilinx and TSMC Collaborate on 7nm Process for Next Generation of All Programmable FPGAs, MPSoCs, and 3D Ics

Xilinx, Inc. announced that it has collaborated with TSMC on the 7nm process and 3D IC technology for its next generation of All Programmable FPGAs, MPSoCs, and 3D ICs. The technology represents the fourth consecutive generation where the two companies have worked together on advanced process and CoWoS 3D stacking technology, and will become TSMC's fourth generation of FinFET technology. The collaboration will provide Xilinx a multi-node scaling advantage and build on its outstanding product, execution, and market success at 28nm, 20nm, and 16nm nodes.

29 May 2015

Xiamen Changelight Acquires Multiple Veeco TurboDisc EPIK 700 GaN MOCVD Systems

Veeco Instruments Inc. announced today that Xiamen Changelight Co., Ltd. (Changelight) has purchased multiple TurboDisc® EPIK™ 700 Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems for faster production and greater yield of high-quality light emitting diodes (LED) for general lighting applications.

From Veeco 29 May 2015

Researchers Use Synthetic Strands of DNA to Create Nanoparticle Clusters and Arrays

Researchers at Brookhaven National Laboratory of the U.S. Department of Energy (DOE) have combined the artificial strands of DNA to function in two ways: rope-like configurations of the DNA double helix were used to create a strong geometrical framework, and dangling pieces of single-strands of DNA were added to stick nanoparticles in place.

26 May 2015

Researchers Create Unexpected Shapes of Mesoscale Atoms

Unexpected shapes of mesoscale atoms -- structures built of microdroplets encapsulated within microdroplets -- have been created at the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw, Poland. The discovery was possible with a new method for precise control over placement of tiny segments of liquid, one in another. With further progress in innovative microfluidic systems, the method may find use in medicine and materials science.

21 May 2015

Elionix Electron Beam Lithography System to be Installed at CUNY Advanced Science Research Center

SEMTech Solutions, in partnership with Elionix, is pleased to announce the delivery of a 100kV Electron Beam Lithography (EBL) system to the City University of New York’s (CUNY) Advanced Science Research Center (ASRC).

20 May 2015

Oxford Instruments CVD Equipment Used for Graphene and 2D Materials Research in Institutes Across Europe and US

As developments in graphene and 2D materials technology continue to increase, research institutes globally are investing in Oxford Instruments’ leading plasma processing Nanofab® equipment using CVD, PECVD and ICPCVD techniques to further their work in this important area.

From Oxford Instruments Plasma Technology 20 May 2015

Nanofabrication News

STMicroelectronics Utilizes IC Compiler II to Tape Out Complex 28nm-FD-SOI SoC

Mild Carbonization Process Converts Polymer Organic Frameworks into Nanometer-Thick Carbon Sheets

ANSYS Software Receives TowerJazz Certification for 80nm PDKs and Reference Design Flow

Ceapro to Scale-Up PGX Technology for Processing Biopolymers into Bio-Nanocomposites

Xilinx and TSMC Collaborate on 7nm Process for Next Generation of All Programmable FPGAs, MPSoCs, and 3D Ics

Xiamen Changelight Acquires Multiple Veeco TurboDisc EPIK 700 GaN MOCVD Systems

Researchers Use Synthetic Strands of DNA to Create Nanoparticle Clusters and Arrays

Researchers Create Unexpected Shapes of Mesoscale Atoms

Elionix Electron Beam Lithography System to be Installed at CUNY Advanced Science Research Center

Oxford Instruments CVD Equipment Used for Graphene and 2D Materials Research in Institutes Across Europe and US

New Nanomaterial Offers Sustainable Drinking Water Solution

New Flexible Material Senses Temperature Without External Power

Carbon Nanofibers Boost Strength and Durability of Fiber Composites

Nano-Formulations Boost Plant Growth and Inhibit Nematode Production

Rapid Biomimetic Nanovaccine for Personalized Cancer Therapy

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

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