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Synopsys Expands Collaboration with Nanoelectronics Research Center imec

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the expansion of its collaboration with nanoelectronics research center imec to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond.

18 Dec 2014

Oxford Instruments Report Successful Nanotechnology Seminars in Delhi, Kolkata

Oxford Instruments and IIT Delhi were honoured by the attendance and enlightening inaugural talk that was given by Dr. Chidambaram, Principal Scientific Advisor to the Government of India at the start of the Oxford Instruments two day technical seminar held at IIT Delhi at the end of November.

From Oxford Instruments Plasma Technology 18 Dec 2014

SMIC Commences Operations at Shenzhen 200mm Wafer Fab

Semiconductor Manufacturing International Corporation, the largest and most advanced pure-play foundry provider in China, announced today it has begun operations at its Shenzhen 200mm wafer fab. This fab is the first 8-inch production line to be put into operation in Southern China, and is also the first domestic IC production line to be launched after the 'National Outline of Promoting the Development of IC Industry' was issued this year.

18 Dec 2014

Amkor Grants GLOBALFOUNDRIES Non-Exclusive License to Copper Pillar Wafer Bump Technology

Amkor Technology, Inc., a leading provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

From GlobalFoundries 17 Dec 2014

Toshiba’s 4TC7734FTG Power Management IC Adopts 130nm Analog Semiconductor Process

Toshiba America Electronic Components, Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new system power management IC (PMIC) designed to help optimize power management functions for a wide range of mobile products.

17 Dec 2014

UofL Micro/Nano Technology Center Founding Director Named Fellow of the National Academy of Inventors

Two researchers at the University of Louisville today were named Fellows of the National Academy of Inventors (NAI).

17 Dec 2014

Broadcom Introduces 28nm Physical Layer Transceivers that Support 2.5G and 5G Ethernet

Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced a new series of physical layer transceivers (PHYs) supporting 2.5G and 5G Ethernet speeds.

16 Dec 2014

Infineon to Transfer 130-nm Automotive-Qualified SPT9 Process Technology to UMC

The semiconductor manufacturer Infineon Technologies AG and United Microelectronics Corporation, a leading global semiconductor foundry, today announced the extension of their manufacturing partnership into power semiconductors for automotive applications. Prior to this expanded partnership, the foundry had been producing Infineon’s logic chips for more than 15 years.

16 Dec 2014

Laser Shock Imprinting to Create 3D Nanoshapes Holds Promise for Mass Production of Plasmonic Metamaterials

A new method that creates large-area patterns of three-dimensional nanoshapes from metal sheets represents a potential manufacturing system to inexpensively mass produce innovations such as "plasmonic metamaterials" for advanced technologies.

15 Dec 2014

Sanan Places Order for 50 Veeco EPIK700 GaN MOCVD Reactors for LED Production

Veeco Instruments Inc. announced today that Sanan Optoelectronics, the largest LED manufacturer in China, has ordered 50 TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) reactors for the production of light emitting diodes (LEDs). This order is the equivalent of 25 EPIK700 MOCVD “C2” (cluster) systems. In keeping with its bookings policy, Veeco will record the purchase order as deposits are received.

From Veeco 15 Dec 2014