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Joint Patterning Center of Excellence Launched by SEMATECH and SUNY CNSE/SUNYIT

SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today they have launched their joint Patterning Center of Excellence. The new Center will leverage the CNSE/SUNYIT lithography infrastructure which includes state-of-the-art film deposition and etch capability, leading-edge patterning systems and SEMATECH's Resist Materials Development Center's (RMDC) world class EUV imaging capabilities.

From College of Nanoscale Science and Engineering, University at Albany 11 Aug 2014

Pt/TiOx (5nm)/ZnO/n+-Si Structure Demonstrates Optimal Resistive Switching Characteristics

Resistance switching of random access memory has been widely explored due to its potential for replacement of ﬂash memory in the next-generation nonvolatile memory applications.

11 Aug 2014

UMC Licenses Cypress’s SONOS Embedded Flash Memory IP for 55-nm Process Technology Node

New Japan Radio Co., Ltd. (New JRC) and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR's MEMS (micro electro mechanical system) microphone products.

From United Microelectronics Corporation 7 Aug 2014

Department of Defense Accredits Novati’s Austin Wafer Fabrication Facility as Category 1A Trusted Foundry

Novati Technologies Inc. (“Novati”), a leading development center for high-performance photonics, MEMS, 2.5D/3D, III-V-on-Silicon and advanced nanotechnology products, today announced that its 68,000 sq. ft. wafer fabrication facility in Austin has been accredited by the Department of Defense (DoD) as a Category 1A Trusted Foundry.

7 Aug 2014

RFaxis to Unveil Family of Nano RF Front-Ends in 40nm CMOS Process

RFaxis, Inc., a leading fabless semiconductor company focused on developing innovative, next-generation RF solutions for the wireless connectivity and cellular mobility markets, today announced that it will be unveiling a family of Nano RF products code named "Nucleus”.

6 Aug 2014

SMIC's 55nm LL eFlash Platform-Based 55nm Smart Card Chip Launched by HED

Semiconductor Manufacturing International Corporation ("SMIC") and CEC Huada Electronic Design Co., Ltd. ("HED") jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform.

From Semiconductor Manufacturing International Corporation (SMIC) 6 Aug 2014

Altera Releases Early Access Design Software for 14-nm FPGAs

Building on the success of early customer benchmarking results announced earlier this year, Altera Corporation today released early access design software for Stratix® 10 FPGAs and SoCs, the industry's first design software targeting 14-nm FPGAs.

5 Aug 2014

IMTS 2014: KERN to Highlight Ultra- and Nano-Precision Machine Tool Technology

KERN Precision, Inc., a subsidiary of KERN Microtechnik GmbH (Germany), today announced it will present ultra- and nano-precision machine tool technology in Booth S-8980 at IMTS 2014, McCormick Place, Chicago, IL, from September 8-13, 2014.

4 Aug 2014

U.S. GAO Chief Scientist Tours NanoMech's Springdale and Fayetteville Facilities

Today, the Chief Scientist for the U.S. Government Accountability Office (GAO) Dr. Timothy Persons visited Northwest Arkansas to meet with NanoMech and tour their facilities in Springdale and Fayetteville.

4 Aug 2014

Xerox Research Centre Canada Issued US Patent for Graphene Nano-Sheets

As one of the world’s top innovative companies, patent milestones honor inventors and serve as a reminder of how important new ideas are to an organization’s future. Xerox researchers worldwide are some of the most prolific inventors in the world – generating more than 1,000 U.S. patents each year.

From Xerox Corporation 1 Aug 2014