Nanofabrication News

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FinScale Offers qFinFET 3D MOSFET Architecture and Manufacturable Process

FinScale Incorporated,the semiconductor device and process innovation company, today announced immediate availability of its qFinFET™ technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers.

9 Jul 2014

Hitachi employs Cadence Tempus Timing Signoff Solution to Tape Out 28nm Design

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Hitachi has taped out its latest giga-scale design using the Cadence Tempus™ Timing Signoff Solution. Hitachi also utilized Tempus Timing Signoff Optimization (TSO), resulting in a reduction of their overall closure time to just 3 weeks down from almost 2 months.

From Cadence Design Systems 8 Jul 2014

Intel to Produce Panasonic SoCs Using 14nm Low-Power Manufacturing Process

Intel Corporation today announced that it has entered into a manufacturing agreement with Panasonic Corporation’s System LSI Business Division. Intel’s custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel’s 14nm low-power manufacturing process.

8 Jul 2014

AMEC Introduces Integrated Dual-Station Etch and Plasma Downstream Asher Semiconductor Processing Tool

Advanced Micro-Fabrication Equipment Inc. (AMEC) today introduced the Primo Integrated Dual-Station Etch and plasma downstream Asher ( Primo iDEA™), an industry-first semiconductor processing tool that integrates dual-station dielectric etch and photoresist strip chambers onto the same platform.

8 Jul 2014

New Applied Materials’ CMP System Provides Wafer Polishing with Nano Precision for FinFET and 3D NAND Applications

Demonstrating its expertise in precision materials engineering, Applied Materials, Inc. today announced two new systems that help customers solve critical challenges in manufacturing high-performance, power-efficient 3D devices.

From Applied Materials Inc. 8 Jul 2014

Microelectronics Equipment Manufacturer, SPTS Technologies, to be Acquired by Orbotech

Orbotech Ltd. today announced the signing of a definitive share purchase agreement to acquire SPTS Technologies Group Limited (“SPTS”), a U.K.-based leading manufacturer of etch, deposition and thermal processing equipment for the microelectronics industry, from European private equity firm Bridgepoint and others.

8 Jul 2014

Suny CNSE/ SUNY IT to Present on sub 10nm Chip Design at SEMICON West 2014

At the SEMICON West 2014 conference in San Francisco next week, the newly merged SUNY College of Nanoscale Science and Engineering/ SUNY Institute of Technology based in Albany, USA, will be detailing some of the research underway at its technology development centres including the use of III-V compounds in next generation chip technology.

7 Jul 2014

SOS Molecules Corralled Into Nanofabricated Patches Trap Membrane-Associated Ras Molecules

A breakthrough discovery into how living cells process and respond to chemical information could help advance the development of treatments for a large number of cancers and other cellular disorders that have been resistant to therapy.

From Lawrence Berkeley National Laboratory 4 Jul 2014

SMIC, Qualcomm Partner on 28nm Wafer Production for Snapdragon Processors

Semiconductor Manufacturing International Corporation ("SMIC";) and Qualcomm Incorporated, have announced that SMIC and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, are working together in connection with 28nm process technology and wafer manufacturing services in China to manufacture Qualcomm® Snapdragon™ processors.

From Semiconductor Manufacturing International Corporation (SMIC) 4 Jul 2014

X-ray Fluorescence Spectroscopy Analyzes Japanese Paper Screens Gilded with Nanometer Scale Gold Leaf

Ancient Japanese gold leaf artists were truly masters of their craft. An analysis of six ancient Namban paper screens show that these artifacts are gilded with gold leaf that was hand-beaten to the nanometer scale.

From Springer - Science and Technology Publishers 4 Jul 2014