ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its long-term partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.
Additionally, Samsung has adopted the 9812D system, the latest generation 1/f noise characterization system, for advanced node process technology development after being a user of 9812B, formerly the industry's de facto standard 1/f measurement system.
ProPlus' BSIMProPlus modeling solutions, the 20-year de facto golden modeling solution, has been used by Samsung for more than 15 years to generate SPICE models for its advanced process technologies, including Samsung's 14nm FinFET technology offerings.
"Samsung has already completed 14LPE FinFET process qualification and started risk production," remarks Dr. Steve Kwon, vice president of Design Service team at Samsung Electronics. "Based on successful collaboration with our ecosystem partners including ProPlus, we overcame technological challenges in 14nm FinFET technology, and are currently providing our customers with complete SPICE modeling support."
As the global leader for SPICE modeling solutions and the leading technology provider for Design-for-Yield (DFY) applications, ProPlus provides advanced modeling solutions to all leading foundries and integrated device manufacturers (IDMs). With 20 years' continuous investment, its BSIMProPlus modeling platform provides the most complete support for all mainstream and leading-edge technologies and is widely used for baseband, RF, noise, reliability, statistical and stress modeling in more than 100 semiconductor companies worldwide.
ProPlus launched 9812D in 2013 for low-frequency noise characterization and process quality monitoring at advanced nodes such as 28nm bulk CMOS, 14nm FinFET and beyond. 9812D offers the highest accuracy, true 10 megahertz (MHz) bandwidth for on-wafer measurement and greatly improved performance with its multiple low-noise amplifiers (LNAs), and a built-in dynamic signal analyzer (DSA) with multi-threaded processing.
"As a valued partner, Samsung has offered us invaluable feedback on our tools and technology roadmap," comments Dr. Zhihong Liu, chairman and CEO of ProPlus Design Solutions. "As a result, we made a significant investment in BSIMProPlus, including increased performance and capability with a full parallel statistical SPICE engine we call NanoSpice.
"BSIMProPlus, with its full variation modeling capabilities, laid the foundation for ProPlus' unique position and focus on DFY and support for advanced process nodes, such as FinFET," adds Dr. Liu.