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DEK Joining Forces with Neutec Electronics to Help Customers in Switzerland

DEK has extended its trusted network of worldwide distributors with the addition of Neutec electronics, a market-leading SMT expert. The move is good news for DEK customers in the region who can now expect an even higher...

1 Dec 2009

Industry's First Volume Production of 3-bit MLC NAND Flash Chips Using 30-nm Process Technology

Industry's First Volume Production of 3-bit MLC NAND Flash Chips Using 30-nm Process Technology

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it commenced the industry's first volume production of 3-bit, multi-level-cell (MLC) NAND flash chips using 30-nanometer (nm)-class process technology at the end of November.

30 Nov 2009

New Double Data Rate Memory Reads Data at Triple the Speed of Single Data Rate NAND Without Increasing Power Consumption

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced the industry's first mass production of its 30-nanometer (nm) class, 32 gigabit (Gb), multi-level-cell (...

30 Nov 2009

TowerJazz Awards Photronics with Photomask Supplier of the Year Award

Photronics, Inc. (Nasdaq:PLAB), a worldwide leader in supplying innovative imaging technology solutions for the global electronics industry, today announced that TowerJazz, a global specialty foundry leader has awarded t...

30 Nov 2009

Obducat Appoints New CEO

Lars Tilly has been appointed new CEO at Obducat, following Patrik Lundström's decision to leave his position. Lars Tilly holds a Ph.D in semiconductor physics and is currently Head of Research at Ericsson in Lu...

From Obducat AB 30 Nov 2009

Applied Materials Introduces Applied Vantage Astra Millisecond Anneal System

Applied Materials Introduces Applied Vantage Astra Millisecond Anneal System

Applied Materials, Inc., today announced its new Applied Vantage® Astra™ millisecond anneal system, an important breakthrough in transistor fabrication that enables faster, lower power consumption devices.

From Applied Materials Inc. 30 Nov 2009

Raising CMP Technology to A New Level

Raising CMP Technology to A New Level

Applied Materials, Inc., today raised CMP* technology to a new level while lowering system cost of ownership (CoO) with the launch of its Applied Reflexion® GT system for advanced metal CMP applications.

From Applied Materials Inc. 30 Nov 2009

Monolithic Laser Combiner System for Confocal and Fluorescence Microscopy

Agilent Technologies Inc., (NYSE: A) today introduced its monolithic laser combiner system for confocal and fluorescence microscopy applications. The MLC400 monolithic laser combiner brings Agilent's patented complex...

30 Nov 2009

Industry's First Abatement and Vacuum Pumping Solution for Controlling Emissions in Semiconductor Fab

Industry's First Abatement and Vacuum Pumping Solution for Controlling Emissions in Semiconductor Fab

Applied Materials, Inc., today unveiled its Applied iSYS™ platform, the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab.

From Applied Materials Inc. 30 Nov 2009

Workshop and Technical Papers Outline Emerging Solutions for Logic and Memory Devices

Engineers from SEMATECH's Front End Processes (FEP) program will present technical papers revealing research breakthroughs at the 55th annual IEEE International Electron Devices Meeting (IEDM) from December 7-9, 2009...

30 Nov 2009

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