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Brion Technologies Reaches Preferred Supplier Agreement with Toshiba Corporation

Brion Technologies, a division of ASML and an industry leader in computational lithography for integrated circuits, has reached a preferred supplier agreement with Toshiba Corporation to implement a comprehensive suite o...

From ASML Special Applications 14 Jul 2009

Flying Start for New Company with Initial Multimillion-Dollar Deal to Key Semiconductor Fab

Global Litho Services (GLS) is pleased to announce its establishment today, providing services and pre-owned lithography equipment to the mature semiconductor, MEMS, and niche application markets. Registered in the Ne...

14 Jul 2009

IMEC Launches New Program Focusing on Development of GaN Technology

IMEC today announces the launch of a new industrial affiliation program (IIAP) that will focus on the development of GaN technology for both power conversion and solid state lighting applications.

From IMEC 14 Jul 2009

IMEC Establishes New Partnerships with Solar Cell Material and Equipment Suppliers

IMEC today announced that it has established new partnerships with solar cell material and equipment suppliers. These companies, including MEMC Electronic Materials Inc., Leybold Optics Dresden GmbH, Roth + Rau AG, and Mallinckrodt Baker B.V., have concluded joint-development agreements with IMEC in the frame of IMEC's newly launched wafer-based silicon photovoltaics industrial affiliation program (IIAP).

From IMEC 14 Jul 2009

Nanometrics Announces Delivery of Unifire Metrology System

Nanometrics Incorporated (Nasdaq: NANO), a leader in the design, manufacture and marketing of high-performance process control metrology systems used primarily in the manufacturing of semiconductors, solar photovoltaics and high-brightness LEDs, today announced the delivery of a Unifire™ metrology system equipped with the Advanced Film Capability (AFC) option.

14 Jul 2009

ESI Bolster its Technology Offerings for 3D IC Packaging and Memory Repair Product Applications

Electro Scientific Industries, Inc. (Nasdaq:ESIO), a leading provider of world-class photonic systems for microengineering, today announced that it has bolstered its technology offerings for both its 3D IC packaging and ...

From Electro Scientific Industries (ESI) 14 Jul 2009

American Nano Silicon Tech Signs Cooperative R+D Agreement with University

American Nano Silicon Technologies, Inc. (OTCBB: ANNO) ("American Nano" or "the Company"), a leading manufacturer and distributor of Micro-Nano Silicon, announced today that the Company has entered in...

14 Jul 2009

SUSS MicroTec and IMEC to Develop Bonding Technology for 3D System Integration

SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of process and test solutions for the semiconductor and related industries, and the Belgian nanoelectronics research center IMEC have entered a joint development program.

From IMEC 14 Jul 2009

ISSYS Signs Intellectual Property Licensing Agreement with Affinity Biosensors

Integrated Sensing Systems, Inc. (ISSYS) announced that it has signed an intellectual property licensing agreement with Affinity Biosensors, LCC of Santa Barbara, CA. Affinity Biosensors is developing and commercializing...

14 Jul 2009

Advanced Diamond Technologies Welcomes UNCD Lightning to its Family of Award-Winning Products

Advanced Diamond Technologies, Inc. (ADT) welcomes UNCD® Lightning™, electrically conductive diamond, to its family of award-winning diamond products. Although natural diamond is highly insulating, UNCD Lightni...

14 Jul 2009