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IC Plus Selects Analog FastSPICE Platform for Full-Circuit Verification of their Mixed-Signal Ics

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that IC Plus Corporation, a communication and networking IC design company has selected the Analog FastSPICE Platform for full-circuit verification of their mixed-signal integrated circuits.

12 Mar 2014

Broadcom Unveils BCM82322 Lite-PHY Fabricated in 28nm CMOS Technology

Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first triple speed 10/40/100G Lite physical layer transceiver (Lite-PHY) designed for high-density data center applications.

12 Mar 2014

CEA-Leti Fabricates Ultra-Scaled Split-gate Memories with Gate Length of 16nm

CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.

From CEA-Leti 12 Mar 2014

Research and Markets Adds International Functional Printing Market Report

Research and Markets has announced the addition of the "Concise Analysis of the International Functional Printing Market - Forecasts to 2020" report to their offering.

12 Mar 2014

Caltech Researchers Develop Novel Light-Bending Silicon Chip with Optical Phased Array

Imagine that you are in a meeting with coworkers or at a gathering of friends. You pull out your cell phone to show a presentation or a video on YouTube. But you don't use the tiny screen; your phone projects a bright, clear image onto a wall or a big screen. Such a technology may be on its way, thanks to a new light-bending silicon chip developed by researchers at Caltech.

12 Mar 2014

NanoIsrael 2014, 4th International Conference and Exhibition on March 24-25

NanoIsrael 2014, the 4th international conference & exhibition, which will be held on March 24th-25th , at the Tel–Aviv David Intercontinental Hotel, Israel, will focus this year on innovations and business opportunities in the fields of medicine, materials, defence, electronics, photonics and energy.

11 Mar 2014

Samsung Electronics Mass Producing Advanced DDR3 Memory Based on 20nm Technology

Samsung Electronics Co., Ltd., the world leader in memory technology, today announced that it is mass producing the most advanced DDR3 memory, based on a new 20 nanometer process technology, for use in a wide range of computing applications.

From Samsung Electronics 11 Mar 2014

MIT Researchers Use Tungsten Diselenide to Produce Optoelectronic Devices

A team of MIT researchers has used a novel material that's just a few atoms thick to create devices that can harness or emit light. This proof-of-concept could lead to ultrathin, lightweight, and flexible photovoltaic cells, light emitting diodes (LEDs), and other optoelectronic devices, they say.

From Massachusetts Institute of Technology 11 Mar 2014

OFC/NFOEC 2014 to Feature Teledyne DALSA’s Latest Developments in MEMS/MOEMS Fabrication

Teledyne DALSA's Semiconductor foundry will feature its latest advancements in MEMS/MOEMS fabrication along with its High Voltage electrostatic actuator ICs at OFC/NFOEC 2014. Hosted at the Los Angeles Convention Center in California, the event runs from March 11-13, 2014, Teledyne DALSA will be located at booth 4653, North Hall.

From Teledyne Technologies Inc. 7 Mar 2014

New Report Analyzes Equipment and Material Markets for Printed and Flexible Electronics

Research and Markets has announced the addition of the "Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics 2014" report to their offering.

From Research and Markets 7 Mar 2014