eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™ devices and MoSys, Inc., a leader in semiconductor solutions that enable fast, intelligent data access for network and communications systems, today announced successful hardware interoperability at 10.3125Gbps and 12.5Gbps between the MGIO (Multi Gigabit I/O) serial transceivers on eASIC’s Nextreme-3 28nm family and the CEI-11 compatible interface on the MoSys® Bandwidth Engine® IC.
eASIC® Nextreme-3 28nm product contains up to 52 high speed 12.5Gbps transceivers and up to 18M equivalent gates. The MGIO transceivers feature advanced transmitter and receiver equalization capabilities coupled with low power consumption making them ideal for a wide variety of systems in networking, computing, and storage applications. The GigaChipTM Interface consumes less than 3% of the eASIC Nextreme-3 N3XT1800 device.
The GigaChip Interface (GCI) is a scalable, high-performance, serial protocol for chip-to-chip communications that delivers system-level benefits of reduced power, cost and complexity. Current implementations built with compatible CEI-11G or XFI SerDes electrical transport standards deliver up to 180Gbps of full duplex throughput using 16 SerDes lanes when running at a 12.5Gbps rate. A key differentiator for the GCI protocol is high transport efficiency, even for small payloads, which makes GCI ideal for co-processor, memory, or multi-chip communication. The interface also includes CRC error detection and automatic error recovery provisions to meet the high-reliability requirements of enterprise, service provider, and mission critical communications and compute applications.
GCI is an open, royalty-free, interface specification originally designed by MoSys for use with the Bandwidth Engine family of ICs and is suitable for any chip-to-chip interconnect.
"We are seeing a major trend towards high speed serial chip-to-chip interconnect which is driven by the system requirements for 40G, 100G and beyond," said Jasbinder Bhoot, vice president of worldwide marketing at eASIC. "The combination of our ability to deliver high performance, low NRE and fast-time to market ASIC devices and the GigaChip Interface benefits of reduced complexity, power and cost, solves the system memory bandwidth limitations in 100G+ carrier-class and enterprise equipment.”
"eASIC is a leader in single mask ASICs and we are pleased to have its support of the GigaChip Interface for its networking customers," said John Monson, VP of marketing and sales for MoSys. "Leveraging the GigaChip Interface with the Bandwidth Engine accelerated memory access and offload capabilities combined with the eASIC Nextreme-3 arrays, our mutual customers will be able to deliver differentiated high performance networking solutions in less time, using less space and at lower cost."
About MoSys, Inc.
MoSys, Inc. (NASDAQ: MOSY) is a fabless semiconductor company enabling leading equipment manufacturers in the networking and communications systems markets to address the continual increase in Internet users, data and services. The company's solutions deliver data path connectivity, speed and intelligence while eliminating data access bottlenecks on line cards and systems scaling from 100G to multi-terabits per second. Engineered and built for high-reliability carrier and enterprise applications, MoSys' Bandwidth Engine® and LineSpeed™ IC product families are based on the company's patented high-performance, high-density intelligent access and high-speed serial interface technology, and utilize the company's highly efficient GigaChip™ Interface. MoSys is headquartered in Santa Clara, California. More information is available at www.mosys.com.
Bandwidth Engine and MoSys are registered trademarks of MoSys, Inc. in the US and/or other countries. GigaChip and LineSpeed are trademarks of MoSys, Inc. All other marks mentioned herein are the property of their respective owners.
eASIC is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs. Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com.