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Investissement Québec Commits $13M for Expansion of Teledyne DALSA’s MEMS and Infrared Imaging Capabilities

Teledyne DALSA, a subsidiary of Teledyne Technologies Incorporated, announced today that it has received a financial commitment totaling $13 million from Investissement Québec to expand the Company’s MEMS and Infrared Imaging capabilities in the Province of Québec.

From Teledyne Technologies Inc. 3 Mar 2014

Increasing Adoption of Mobile Devices Drives Global Wafer-level Packaging Equipment Market

Research and Markets has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering.

From Research and Markets 3 Mar 2014

Renesas Unveils RX64M Microcontrollers Fabricated in 40 nm Process

Renesas Electronics Corporation (TSE:6723), a premier provider of advanced semiconductor solutions, today unveiled the RX64M Group of microcontrollers (MCUs), its first product in the flagship RX Family of 32-bit MCUs to be fabricated in a 40 nm process.

28 Feb 2014

Quantitative, Qualitative Report on Global Graphene Electronics Market

Research and Markets has announced the addition of the "Graphene Electronics Market: Materials, Devices, Products, & Developments 2013 - 2023" report to their offering.

From Research and Markets 27 Feb 2014

InterDigital and imec Enter Agreement to Develop 60 GHz mmW Radio and Phased Array Technology

InterDigital, Inc., a wireless research and development company, and nano-electronics research center imec, today announced an agreement to develop 60 GHz millimeter wave (mmW) radio and phased array technology for small cell backhaul and 5G wireless communications. The technology will enable easier deployments for small cell mobile backhaul resulting in lower cost solutions for high-speed data delivery.

From IMEC 25 Feb 2014

Novel Microparticles with Three Chemically Different Segments

A team of researchers of Karlsruhe Institute of Technology (KIT) and the University of Michigan/USA has produced novel microparticles, whose surface consists of three chemically different segments.

24 Feb 2014

Gentle Techniques Used to Create Nanocapacitors

Electronics are getting smaller all the time, but there's a limit to how tiny they can get with today's materials. Researchers now say, however, that they have developed a way to shrink capacitors — key components that store energy — even further, which could accelerate the development of more compact, high-performance next-gen devices. The study appears in the journal ACS Nano.

From American Chemical Society 21 Feb 2014

Toshiba Introduces Client SSDs Integrating NAND Chips Fabricated with 19nm Second-Generation Process Technology

Toshiba Corporation today announced the launch of the “HG6 series” of client SSDs integrating NAND chips fabricated with 19nm second-generation process technology. Shipping will start from March.

20 Feb 2014

Metal Oxide Shell Coating Increases Life Span of Nanoelectronics

The debut of cyborgs who are part human and part machine may be a long way off, but researchers say they now may be getting closer. In a study published in ACS' journal Nano Letters, they report development of a coating that makes nanoelectronics much more stable in conditions mimicking those in the human body.

From American Chemical Society 20 Feb 2014

Standard Chip-Making Processes Can Be Used to Fabricate Low Power Photonic Devices

The future of computing may lie not in electrons, but in photons – that is, in microprocessors that use light instead of electrical signals. But these so-called photonic devices are typically built using customized methods that make them difficult and expensive to manufacture.

20 Feb 2014