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Akustica and Bosch Sensortec Showcase MEMS Sensors and Solutions at CES Show

Bosch, a MEMS sensor manufacturer, has declared that Akustica and Bosch Sensortec, two companies from the Bosch Group will be together displaying their range of consumer MEMS products in Las Vegas at the Consumer Electronics Show (CES) this week.

12 Jan 2012

Nova’s Metrology Solutions Chosen for 11 and 14 nm Technology Node Development

Nova Measuring Instruments has declared that its metrology and software solutions have been chosen by a major logic manufacturer to support the development of 11 and 14 nm process technology nodes and upcoming production.

From Nova Measuring Instruments 12 Jan 2012

SanDisk to Build iNAND Ultra Line Using 19 nm Production Technology

SanDisk has declared that its iNAND Ultra series of products will be built on its 19 nm production process. The iNAND Ultra series is the first of the company’s portfolio of flash memory products to be developed using the sophisticated production technology in 2012.

12 Jan 2012

Nanometrics Implements its Optical Critical Dimension Technology

Nanometrics, a provider of sophisticated process control systems and solutions, has reached an important milestone signifying the implementation of its optical critical dimension (OCD) technology.

11 Jan 2012

Rare Earth Ion Doped Optical Amplifier with Performance Comparable to Semiconductor Amplifiers

Prof. Markus Pollnau and co-workers at the MESA+ Institute for Nanotechnology at the University of Twente have developed a rare-earth-ion-doped optical amplifier with performance comparable to semiconductor amplifiers.

From John Wiley and Sons - Scientific Publishers 10 Jan 2012

Checkpoint Technologies Releases 3.0 NA SIL for Laser Scanning Microscopy System

Checkpoint Technologies, a provider of laser scanning and photon emission microscopy systems for applications in the failure analysis industry, has unveiled its 3.0 numerical aperture (NA) solid immersion lens objective (SIL).

7 Jan 2012

STATS ChipPAC Breaks Ground for New Plant to Bolster Advanced Wafer Level Technologies

STATS ChipPAC, a provider of semiconductor advanced packaging and test solutions, has conducted the groundbreaking ceremony for its new plant to be built close to its existing facility in Yishun, Singapore, to expand its production capabilities for sophisticated wafer level technologies such as through silicon via (TSV), integrated passive devices (IPD), wafer level chip scale packaging (WLCSP) and embedded wafer level ball grid array (eWLB).

7 Jan 2012

Major Chip Provider Places Orders for ANTARES Single-Wafer CryoKinetic Systems

FSI International, a provider of surface conditioning technology, devices and support services for the production of microelectronics, has declared that it has received orders from a major equipment manufacturer for several ANTARES cryokinetic cleaning systems.

7 Jan 2012

Strategic Partnership to Develop Silicon Magnetics Using Enpirion’s MEMS Magnetics Technology

Enpirion and JiangyinChangdian Advanced Packaging (JCAP) have signed a strategic collaboration deal to produce silicon-based magnetics using the micro-electronic magnetic silicon (MEMS) technology of Enpirion.

5 Jan 2012

LSI Demonstrates 28 nm Read Channel to HDD OEM Customers

LSI has declared that it has demonstrated the TrueStore RC5100, a first-of-its-kind 28 nm read channel, to OEM customers producing hard disk drives (HDD).

26 Dec 2011