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Applied Materials Unveils Fully Automatic Defect Inspection SEM for Rapid Chip Production

Applied Materials has established its presence in defect inspection scanning electron microscope (SEM) technology with the introduction of the first-of-its-kind tool called the Applied SEMVision G5 system that allows chip manufacturers to image and study 20 nm yield-limiting imperfections with no manual interference.

From Applied Materials Inc. 8 Dec 2011

Samsung’s Wafer Production Facility in Austin Reaches Targeted Capacity in Record Time

Samsung Austin Semiconductor has declared that it has completed construction and has ramped up to mass production of S2, its 300 mm automated fab in Austin, Texas, in record time.

8 Dec 2011

Gigaphoton Supplies 1,000th Excimer Laser for Semiconductor Photolithography

Gigaphoton, a provider of lithography light sources, has announced the delivery of its 1,000th excimer laser for photolithography applications in semiconductor fabrication.

7 Dec 2011

SUSS MicroTec Launch XBS300 Temporary Bonder

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS MicroTec's latest generation of high volume manufacturing tem...

From SUSS MicroTec AG 5 Dec 2011

International Rectifier Buys Several Physical Vapor Deposition Systems from NEXX Systems

NEXX Systems, a processing equipment provider for sophisticated wafer-level packaging applications, has declared that International Rectifier, a provider of power management solutions, has bought several Apollo physical vapor deposition (PVD) systems for its fab facility located in Newport, Wales.

5 Dec 2011

FSI International to Supply ORION Single Wafer Cleaning Systems to Two Semiconductor Producers

FSI International, a provider of surface conditioning devices for the production of microelectronics, has declared that two major semiconductor manufacturers have placed follow-on orders for FSI International’s ORION single wafer cleaning systems.

5 Dec 2011

Zhong Lin Wang Wins MRS Medal for Nanotechnology Innovations

Zhong Lin Wang, Regent’s Professor of the Georgia Institute of Technology has been awarded a 2011 Materials Research Society Medal for his technology innovations based on zinc oxide nanostructures on November 30 2011 at the society’s fall meeting conducted in Boston.

5 Dec 2011

Polyera, Thin Film Electronics Sign Deal for Commercialization of Printed CMOS Memory

Thin Film Electronics and Polyera have entered into a partnership for the development of organic semiconductor materials for the mass printing of integrated systems and Thinfilm Addressable Memory, paving the way for commercializing printed integrated solutions such as smart sensor tags.

3 Dec 2011

ASML, Tokyo Electron Sign Joint Development Deal for Lithography and EUV Technologies

ASML has signed a deal with Tokyo Electron to jointly promote ArF immersion and extreme ultraviolet (EUV) development activities utilizing advanced lithography cluster.

2 Dec 2011

Analog Bits Reveals Availability of Product Lines at 28 nm Node Process Technologies

Analog Bits has revealed that it now offers key product lines at the 28 nm node process technologies. The company disclosed for the first time that it has supplied several 28 nm IP for lower power and high performance processes and has working silicon on the 32 nm process nodes.

2 Dec 2011

Nanoelectronics News

Applied Materials Unveils Fully Automatic Defect Inspection SEM for Rapid Chip Production

Samsung’s Wafer Production Facility in Austin Reaches Targeted Capacity in Record Time

Gigaphoton Supplies 1,000th Excimer Laser for Semiconductor Photolithography

SUSS MicroTec Launch XBS300 Temporary Bonder

International Rectifier Buys Several Physical Vapor Deposition Systems from NEXX Systems

FSI International to Supply ORION Single Wafer Cleaning Systems to Two Semiconductor Producers

Zhong Lin Wang Wins MRS Medal for Nanotechnology Innovations

Polyera, Thin Film Electronics Sign Deal for Commercialization of Printed CMOS Memory

ASML, Tokyo Electron Sign Joint Development Deal for Lithography and EUV Technologies

Analog Bits Reveals Availability of Product Lines at 28 nm Node Process Technologies

Ultrasound-activated Nanoparticles Kill Liver Cancer and Activate Immune System

Twisted Graphene Shows Unconventional Superconductivity

SNA-Based Drug Slow Cancer Progression 59-Fold in Animal Models

Polymer-Coated Nanoparticles Target and Clear Disseminated Ovarian Cancer

Magnetic Nanocarbon Composite Cleans Chernobyl’s Wastewater

Turning Almond Shells into Electronics: A Conversation on Laser-Induced Graphene

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

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