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Adapteva Releases 28 nm 64 RISC Core Epiphany-IV Microprocessor Chip

The semiconductor technology company located in Lexington, Massachusetts, Adapteva has revealed the 4th generation Epiphany multicore architecture IP in 28 nm chip design.

7 Oct 2011

Rudolph Delivers Wafer Scanner and Macro Defect Inspection Systems to Semiconductor Manufacturer

Rudolph Technologies proclaimed that it has delivered its multiple NSX Macro Defect Inspection Systems, Wafer Scanner 3880 3D Inspection System and Discover Yield Management Software Suite to a major semiconductor manufacturing company for developing sophisticated three-dimensional IC integration using through silicon via (TSV) based processes.

From Onto Innovation 7 Oct 2011

Nanoinformatics 2011 Announce Call for Posters

Nanoinformatics 2011 will bring together informatics experts, nanotechnology researchers, and other stakeholders and potential contributors to advance Nanoinformatics 2020 Roadmap goals. The workshop will set a clear pat...

6 Oct 2011

STPS Completes Shipment of its 600th Advanced Vertical Processor for LPCVD Systems

Thermal processing equipment manufactures SPTS Technologies announced that it has shipped its 600th advanced vertical processor (AVP) vertical batch thermal processing system.

1 Oct 2011

Samsung Announces Development of 30 nm Class Process-Based LPDDR3 DRAM

At the eighth annual Samsung Mobile Solutions Forum conducted at Westin Taipei, Samsung Electronics has proclaimed that it has developed a first-of-a-kind monolithic 4 Gb low power double-data-rate 3 (LPDDR3) memory utilizing 30 nm-class process technology to support three-dimensional graphics, ultra resolution displays and quicker processers in the advanced future-generation mobile devices.

From Samsung Electronics 30 Sep 2011

Asian Foundry Producer to Adopt FSI International’s ORION Single Wafer Cleaning System

FSI International, a provider of surface conditioning equipment for the production of microelectronics, has proclaimed that a major foundry producer in Asia has agreed to adopt an ORION single wafer cleaning system.

30 Sep 2011

Samsung Unveils 32 nm HKMG Logic Low Power Process-Based Application Processor

Samsung Electronics has expanded its Exynos product portfolio with the introduction of a dual core ARM Cortex application processor called the Exynos 4212, developed on its sophisticated 32 nm High-K Metal Gate (HKMG) logic low-power process technology.

From Samsung Electronics 30 Sep 2011

Crossing Automation Launches Spartan 450 for Wafer Production

Crossing Automation, which designs and produces fab and tool automation products, has launched the Spartan 450, a 450 mm volume sorter for manufacturing 450 mm wafers.

28 Sep 2011

Oxford Instruments Present Inaugural Award for Best MSc Project in Nanotechnology

Oxford Instruments are delighted to announce that Adnan Mehonic is the recipient of our first Oxford Instruments Plasma Technology award for the Best MSc Project in Nanotechnology at UCL, entitled 'Current transport studies of silicon nanoclusters'.

27 Sep 2011

D2S Introduces Mask-Wafer Double Simulation Workstation for 20-nm-Node and Below Designs

D2S has unveiled first-of-a-kind mask-wafer double simulation accelerated workstation called TrueMask DS for hot-spot analysis, bit-cell design, research and development exploration and mask-defect classification that understands dose modulation and overlapping eBeam shots.

23 Sep 2011