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Magma Unveils Next-Gen ICs at 28-nm Process Node to Accelerate SoC Implementation

Magma® Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software, today unveiled Talus® 1.2, a next-generation integrated circuit (IC) implementation solution that accelerates the design cycle of s...

4 Dec 2010

DARPA Awards $8.4 Million to UCLA to Develop Non-Volatile Electronic Technology

The Defense Advanced Research Projects Agency (DARPA) has awarded the UCLA Henry Samueli School of Engineering and Applied Science an $8.4 million grant for research on a technology known as non-volatile logic, which enables computers and electronic devices to keep their state even while powered off, then start up and run complex programs instantaneously.

From University of California, Los Angeles 3 Dec 2010

Sensonor Wins New Product Innovation Award for STIM202 3-Axis MEMS Gyroscope

The New Product Innovation Award is a prestigious recognition of Sensonor’s accomplishments in the high precision MEMS gyroscopes market.

3 Dec 2010

SAFC Hitech Reinforces Commitment to the Asia-Pacific Electronics Markets

Following the March 2010 production expansion of trimethylgallium (TMG) at its Bromborough, UK manufacturing site, SAFC Hitech(R), a member of the Sigma-Aldrich(R) Group, reinforced its commitment to the Asia-Pacific ele...

2 Dec 2010

Houston University Graduate Students to Present at TcSUH's Student Symposium

A high school math teacher in India sparked Debtanu De's interest in physics. Ibrahim Kesgin was inspired by his father to pursue an undergraduate, then graduate degree in mechanical engineering. Melissa Gooch&#39...

2 Dec 2010

Tegal to Launch ProNova2 ICP Reactor for MEMS Applications at 2010 SEMICON Japan

This week at SEMICON Japan, Tegal Corporation : an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and 3D ICs, will launch the newest member of its popular ProNovaTM family of high-density inductively coupled plasma (ICP) reactors for the company´s DRIE series wafer processing products.

From Collabrx, Inc. 2 Dec 2010

Samsung Starts Sampling of 4Gb LPDDR2 DRAM Using 30nm-Class Technology

Samsung Electronics Co., Ltd, a global leader in advanced semiconductor technology solutions, announced today that it has developed and started sampling the industry’s first monolithic four gigabit (Gb), low power double-data-rate 2 (LPDDR2) DRAM using 30 nanometer (nm) class technology in November.

From Samsung Electronics 2 Dec 2010

Scientists Discover That Grinding of New Compound Creates Cubic Molecular Structures

During the normal grinding of powders in a mortar, the powders can enter into chemical reactions with each other. This phenomenon has been known for years but only now it has become possible to transform in this way three-dimensional clusters of certain chemical compounds into other, also three-dimensional, clusters.

2 Dec 2010

Argonne Researchers Get 65 Million Hours of Computing Time on Supercomputer

Four researchers at the U.S. Department of Energy's (DOE) Argonne National Laboratory lead projects that have been awarded a total of 65 million hours of computing time on Argonne's energy-efficient Blue Gene/P (...

From Argonne National Laboratory 2 Dec 2010

LSI Introduces TrueStore 40-nm Read Channel with LDPC Iterative Decoding Technology

LSI Corporation (NYSE: LSI) today announced the TrueStore® RC9700, a second-generation 40-nanometer (nm) read channel featuring low-density parity check (LDPC) iterative decoding technology. Now sampling to hard d...

2 Dec 2010