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Xradia to Present Solutions for Semiconductor Failure Analysis at Semicon Japan

Xradia Inc., the leading provider of high-resolution non destructive 3D X-ray imaging systems, announced today that its solutions for semiconductor failure analysis will be presented by its representative, Canon Marketing Group Japan, in CMJ's booth 3C-701 during Semicon Japan.

1 Dec 2010

Scientists Determine Number of Atoms in Current Flow at Nanoscale Level

Thanks to collaborative work between scientists in Donostia-San Sebastian and the University of Kiel (Germany) it has been shown that it is possible to determine and control the number of atoms in contact between a molec...

1 Dec 2010

German Researchers Fabricate Hybrid Quantum Computer Using Nano-Diamonds

Quantum information processing is arguably one of the most fascinating facets of modern quantum physics.

1 Dec 2010

Novel Silicon-Germanium Technology for Designing Space Electronics

A five-year project led by the Georgia Institute of Technology has developed a novel approach to space electronics that could change how space vehicles and instruments are designed. The new capabilities are based on silicon-germanium (SiGe) technology, which can produce electronics that are highly resistant to both wide temperature variations and space radiation.

1 Dec 2010

SiTime Upgrades Website Offering Streamlined Access to Engineers

SiTime Corporation, the leader in MEMS-based silicon timing solutions today launched its redesigned www.sitime.com website. In addition to offering comprehensive product, application and support information, the new w...

30 Nov 2010

Korea-Based Nano Fibers Maker Approves $10 Million Investment by GE Capital

Finetex EnE, Inc., a Korea based manufacturer of electrospun nano fibers, disclosed November 25, 2010 that its Board of Directors has approved the terms of a private issue of Convertible Bonds to GE Capital valued at $10 million.

30 Nov 2010

FlexTech Alliance Provides Contract to Cambridge NanoTech to Accelerate ALD Process

The FlexTech Alliance, focused on developing the electronic display and the flexible, printed electronics industry supply chain, announced today that it has awarded a contract to Cambridge NanoTech to develop a high-speed Atomic Layer Deposition (ALD) system.

30 Nov 2010

Altatech Semiconductor Launches New System to Inspect Wafer Edges

Altatech Semiconductor S.A. today introduced its new high-throughput AltaSight EyeEdge® inspection system, capable of detecting, identifying and generating images of defects as small as 2 microns along the edges of 300 mm semiconductor wafers, including silicon, compound semiconductor, SOI, quartz and transparent substrates.

30 Nov 2010

Biomedical Engineers Develop Connector for Microfluidic Devices

Biomedical engineers at UC Davis have developed a plug-in interface for the microfluidic chips that will form the basis of the next generation of compact medical devices.

30 Nov 2010

Fuzhou Rockchip Uses SMIC’s 65-nm Low Power Process for SOC Chip Production

Fuzhou Rockchip Electronics Co., Ltd. (hereinafter referred to as "Rockchip"), a leading Fabless Semiconductor company and mobile-internet SOC solution provider, today announced that its design of a high-end di...

30 Nov 2010