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New Research Project to Explore Potential of Graphene-Based Thermoplastics

New research will demonstrate the significant improvements in mechanical, electrical, thermal and barrier properties of thermoplastics that can be achieved by introducing graphene to the polymer. The reinforcement of...

1 Nov 2010

European Power Microelectronics Industry to Benefit from LAST POWER Project

The partners in a new publicly-funded European research project today announced details of the multinational/multidisciplinary program called LAST POWER ('Large Area silicon carbide Substrates and heTeroepitaxial GaN for POWER device applications).

From STMicroelectronics 30 Oct 2010

DesignWare 40-nm HDMI 1.4a Transmitter Solution from Synopsys Achieves HDMI Certification

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Synopsys' DesignWare® High-Definition Multimedia Interface™ (HDMI™) 1.4a Transmitter (Tx) digital controller and PHY IP solutions in the 40-nanometer (nm) process node have achieved certification from an HDMI Authorized Training Center (ATC).

From Synopsys, Inc. 30 Oct 2010

Development of Piezoelectric Nanogenerators for Use in Biomedical Devices

Imagine a world where pacemakers never need new batteries and a walk through a park keeps your mp3 player at full charge. Dr. Yong Shi, Assistant Professor of Mechanical Engineering at Stevens Institute of Technology,...

30 Oct 2010

STMicroelectronics Introduces New Automotive-Grade MEMS Accelerometer

STMicroelectronics, a leader in MEMS, has expanded its sensor portfolio with a new automotive-grade 3-axis low-g accelerometer.

From STMicroelectronics 30 Oct 2010

Shocking Technologies Achieves UL Certification for Voltage Switchable Dielectric Nano-Composite Material

Shocking Technologies, Inc. has received notification from Underwriters Laboratories (UL) that it has been awarded 94V-0 certification for its XStatic(TM)100 product, a voltage switchable dielectric (VSD™) material...

30 Oct 2010

Quest Could Form Basis of New Approach to Electronics

Researchers at Oregon State University have solved a quest in fundamental material science that has eluded scientists since the 1960s, and could form the basis of a new approach to electronics.

29 Oct 2010

SMIC Signs Cooperation Agreement to Invest in Wuhan Xinxin’s 12-Inch Wafer Production Facilities

The Wuhan East Lake Hi-Tech Development Zone Administrative Committee and Semiconductor Manufacturing International Corporation ("SMIC," NYSE: SMI, SEHK: 0981.HK) today signed a cooperation framework agreement ...

From Semiconductor Manufacturing International Corporation (SMIC) 29 Oct 2010

Atrenta, CEA-Leti to Focus on Advanced Power Reduction and 3D Design

Atrenta Inc., the leading provider of Early Design Closure® solutions to radically improve design efficiency throughout the IC design flow, announced today the signing of a multi-year collaboration agreement with CEA-Leti, the Electronics and Information Technology Laboratory of the French Atomic Energy Commission.

From CEA-Leti 28 Oct 2010

Xilinx’ Stacked Silicon Interconnect Technology Delivers Power Efficiency Using FPGA Technology

Xilinx, Inc. (Nasdaq: XLNX) today announced the industry's first stacked silicon interconnect technology for delivering breakthrough capacity, bandwidth and power savings using multiple FPGA die in a single package for applications that require high-transistor and logic density, as well as tremendous levels of computational and bandwidth performance.

28 Oct 2010