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Electronic Firms to Present at IFA 2010 Event in Hong Kong

Georgia Tech Scientists Develop New Class of Devices Using Zinc Oxide Nanowires

Georgia Tech Scientists Develop New Class of Devices Using Zinc Oxide Nanowires

New Dispensing System from Nordson ASYMTEK Ideal for Wafer-Level Packaging

New Dispensing System from Nordson ASYMTEK Ideal for Wafer-Level Packaging

GLOBALFOUNDRIES Introduces Qualification Vehicle Based on 28nm Technology

Texas Instruments Purchases Two Wafer Fabs in Japan

Texas Instruments Purchases Two Wafer Fabs in Japan

GLOBALFOUNDRIES to Bring New 90nm Flash Memory Technology to Market

World's Fastest Computer Chip Based on IBM's 45nm Silicon Technology

World's Fastest Computer Chip Based on IBM's 45nm Silicon Technology

GLOBALFOUNDRIES Showcases Industry’s First Open-Access 28nm AMS Production Design Flow Development Kit

GLOBALFOUNDRIES Showcases Industry’s First Open-Access 28nm AMS Production Design Flow Development Kit

Scientists Create First Two-Terminal Memory Chips Using Only Silicon

Scientists Create First Two-Terminal Memory Chips Using Only Silicon

Study Shows That Aixtron Leads in the Multi-Wafer MOCVD Market

Study Shows That Aixtron Leads in the Multi-Wafer MOCVD Market

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