Nanoelectronics News

RSS

Record Shipment of STATS ChipPAC’s Embedded Wafer-Level Ball Grid Array Units

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading semiconductor test and advanced packaging service provider, today announced it has achieved a major industry milestone in the volume ramp of embedded Wafer-Level Ball Grid Array (eWLB) technology with more than 35 million units shipped.

31 Aug 2010

KLA-Tencor Unveils New Wafer Edge Inspection and Metrology Tool

Today KLA-Tencor Corporation™, the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, announced the latest addition to its industry-leading VisEdge family of products: the VisEdge CV300R-EP edge metrology and inspection tool.

31 Aug 2010

ZOLL Medical Selects ADI’s iMEMS Technology for PocketCPR Device

Analog Devices, Inc. today announced that ZOLL Medical Corporation has selected ADI’s high performance iMEMS® technology to enable its palm-sized CPR (cardiopulmonary resuscitation) device that measures the rate and depth of chest compressions administered by rescuers.

From Analog Devices 27 Aug 2010

FlexTech Alliance to Develop Foldable Display for Nyx Illuminated Clothing

The FlexTech Alliance, focused on developing the electronic display and the flexible, printed electronics industry supply chain, today announced a contract award to Nyx Illuminated Clothing Company to develop a foldable ...

27 Aug 2010

First DRAM Module Based on Nano Thermal Dissipation Technology

Golden Systems Middle East, a leading distributor of IT products, announced the launch of the world’s first invisible heat sink DRAM module, the KINGMAX DDR3 2200MHz with Nano Thermal Dissipation Technology, in the Middle East region.

27 Aug 2010

Researchers Develop New Transparent Conductive Oxides Using Quantum Mechanics

European researchers have combined computer modelling of quantum mechanics and precision fabrication processes to create novel transparent conductive oxides made to order for a wide range of scientific and consumer applications.

27 Aug 2010

New Research Report on Fan-Out Wafer Level Packaging

Reportlinker.com announces that a new market research report is available in its catalogue: Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate http://www.reportlinker.com/p0265750/Embedded-Wafer-...

27 Aug 2010

Sandwiching Nanoparticle Layer Can Boost Performance of Organic Transistors

A pioneering study by researchers of The Hong Kong Polytechnic University (PolyU) has shown that sandwiching a simple layer of silver nanoparticles can significantly improve the performance of organic transistors which are commonly used in consumer electronics.

27 Aug 2010

New Book on Nanotechnology for Telecommunications

Sohail Anwar, associate professor of engineering at Penn State Altoona, recently published a book titled "Nanotechnology for Telecommunications," co-edited by Raja, Qazi, and Ilyas and published by CRC Press/Ta...

26 Aug 2010

Magma’s iPOP Program Enables Use of Quartz Products for 65nm Processes

Magma® Design Automation Inc., a provider of chip design software, today launched Quartz iPOP, the “improved Productivity, Operability and Performance” initiative to facilitate designers’ adoption of the Quartz™ DRC and Quartz LVS software for designs targeted at 65 nanometers (nm) and below.

26 Aug 2010