Nanoelectronics News

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Virage Logic’s Solution Supports RDC's SoC Design at 65nm Process

Virage Logic Corporation, the semiconductor industry's trusted IP partner, today announced that RDC Semiconductor Co., Ltd of Hsinchu, Taiwan has chosen the Intelli all digital, correct-by-construction DDR3 PHY+DLL for the next-generation RDC IAD Processor Platform targeting the high volume net-based consumer electronics (CE) market.

26 Jul 2010

UBM TechInsights Awards Winbond for 65nm 1Gbit DDR2 SDRAM

UBM TechInsights has announced Winbond Electronics as the winner of the Most Innovative DRAM award in TechInsights' 9th Annual Insight Awards. Winbond's 65nm buried wordline 1Gbit DDR2 SDRAM garnered the award. ...

26 Jul 2010

New Thin-Film Chips Help to Achieve 30% Increase in LED Efficiency

Developers at OSRAM Opto Semiconductors have succeeded in increasing the efficiency of red thin-film LEDs by 30% – a new record.

26 Jul 2010

Eco-Friendly Way for Mass Production of Graphene Oxide

"We can make you and we can break you." If Rice University scientists wrote country songs, their ode to graphene oxide would start something like that. But this song wouldn't break anybody's heart. A new paper fr...

23 Jul 2010

New Advanced Cooling Technology for Electronics Uses Carbon Nanotubes

Researchers have shown that an advanced cooling technology being developed for high-power electronics in military and automotive systems is capable of handling roughly 10 times the heat generated by conventional computer chips.

23 Jul 2010

Photonics Professor Works on Quantum Computing

When waves - regardless of whether light or sound - collide, they overlap creating interferences. Austrian and Canadian quantum physicists have now been able to rule out the existence of higher-order interferences experimentally and thereby confirmed an axiom in quantum physics: Born's rule.

23 Jul 2010

Major Chipmaker Orders Three Wafer Inspection Systems from Camtek

Camtek Ltd. (NASDAQ and TASE: CAMT) ("Camtek"), announced today that it received follow-on orders for three wafer inspection systems from a major IDM (Integrated Device Maker) and chipmaker. The three system...

23 Jul 2010

Fujitsu Deploys Cadence’s Technology for Logic Design at 65-nm Process

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Fujitsu Limited has adopted the Cadence® Encounter® Conformal® ECO Designer to cut costs and reduce design time in its engineering change order (ECO) implementation flow.

From Cadence Design Systems 23 Jul 2010

Virage Logic Expands Collaboration with SMIC for 40nm LL Process Technology

Virage Logic Corporation (Nasdaq: VIRL), the semiconductor industry's trusted IP partner, and Semiconductor Manufacturing International Corporation (SMIC; NYSE: SMI and SEHK: 0981.HK), the leading foundry in China, t...

23 Jul 2010

Samsung to Develop Advanced NAND Flash Memory Along with Toshiba

Samsung Electronics Co., Ltd. and Toshiba Corporation today announced their commitment to development of the most advanced high-performance NAND flash memory technology available today – a double data rate (DDR) NAND flash memory with a 400 megabit-per-second (Mbps) interface, toggle DDR 2.0 specification.

From Samsung Electronics 22 Jul 2010