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TSMC Deploys Laker System to Save Time for IC Design Teams

TSMC Deploys Laker System to Save Time for IC Design Teams

Vitesse’s New 12-Port PHY Device Leverages 65-nm Technology with SparX-III GE Switch

Vitesse’s New 12-Port PHY Device Leverages 65-nm Technology with SparX-III GE Switch

GLOBALFOUNDRIES Plans to Expand Wafer Manufacturing Facility in Dresden

SPTS Receives Order for 300mm Pegasus DSi Etch System from Fraunhofer IZM

Researchers Study Carbon Nanotube Application to Build Electronic Components

Kodak, MacDermid to Provide High-Quality Film Solutions for Printed Electronics Applications

Kodak, MacDermid to Provide High-Quality Film Solutions for Printed Electronics Applications

eSilicon Acquires Silicon Design Solutions

eSilicon Acquires Silicon Design Solutions

Elpida Develops 65nm XS Version 1-Gigabit DDR3 SDRAM for DRAM Market

Elpida Develops 65nm XS Version 1-Gigabit DDR3 SDRAM for DRAM Market

Semiconducting Sandwich Filling Retains its Mystery

Tecella Launches New Lines of Amplifiers for Recordings from Nanopore Arrays

Tecella Launches New Lines of Amplifiers for Recordings from Nanopore Arrays

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