Research and Markets (http://www.researchandmarkets.com/research/f84640/inorganic_and_comp) has announced the addition of the "Inorganic and Composite Printed Electronics 2010-2020" report to their offering.
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A researcher at North Carolina State University has developed a computer chip that can store an unprecedented amount of data – enough to hold an entire library's worth of information on a single chip. The new chip s...
Synapse Wireless®, Inc. and Silicon Laboratories Inc. (NASDAQ: SLAB) today introduced a jointly developed wireless mesh networking solution that combines the award-winning Synapse SNAP® network operating system with...
SVTC Technologies, the leading commercialization service provider for new, emerging silicon-based technologies in areas such as CMOS, MEMS, photovoltaics and other related nanotechnologies, is pleased to announce that it is now offering ITAR compliant development and manufacturing services, allowing customers to develop process technologies and manufacture products with potential defense applications.
"Hot sounds" has one meaning to music fans and another to physicists. Count a team of researchers at Rice University among the latter, as they've discovered that acoustic waves traveling along ribbons of graphene might be just the ticket for removing heat from very tiny electronic devices.
To continue the industry's historical trend of performance scaling, SEMATECH experts reported on integrated approaches to CMOS logic and memory device technology and 3D TSV (through silicon via) manufacturing at the International Symposium on VLSI Technology, System and Applications (VLSI-TSA) on April 26-28, 2010.
Noliac Systems offers custom made high voltage stacks made of piezoceramic monolayer discs. The stacks are specifically designed for highly dynamic applications such as micro positioning, precision mechanics, switches and laser tuning.
LMU materials scientist Dr. Rossitza Pentcheva and her team explored novel phenomena arising at the interface between the two insulators lanthanum aluminate (LaAlO3) and strontium titanate (SrTiO3).
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced the industry’s first multi-chip package (MCP) with PRAM – for use in mobile handsets beginning later this quarter.
Nanometrics Incorporated today announced that additional UniFire™ 7900 metrology systems have been delivered and qualified by an existing customer, and are currently in production for high volume manufacturing process control of advanced wafer-level packaging processes.
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