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TSMC Skips 22nm Manufacturing Process Node and Move Directly to 20nm Technology

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) announced today at its 2010 Technology Symposium that it will skip the 22nm manufacturing process node and move directly to a 20nm technology. The move is value driven to make advanced technology a more viable alternative for its customers.

From TSMC Taiwan Semiconductor Manufacturing Company 13 Apr 2010

Engineers Dominate Two of the Most Influential Annual Academic Conferences

The engineers from the Department of Electrical and Computer Engineering (ECE) at the University of California, San Diego who are at the forefront of the latest "silicon revolution" will, for another year, dominate two of the most influential annual academic conferences focused on advanced wireless communications technologies - IMS 2010 and RFIC 2010.

13 Apr 2010

Applied Materials Opens Advanced Semiconductor Equipment Plant in Singapore

Applied Materials, Inc., the world’s leading supplier of equipment to the semiconductor, flat panel display and solar photovoltaic (PV) industries, today opened its new Singapore Operations Center, Applied’s first facility in Asia for manufacturing its advanced semiconductor equipment.

From Applied Materials Inc. 13 Apr 2010

Vishay Announces Thin Film Chip Resistors in New Case Sizes

Vishay Intertechnology, Inc. today announced that it has extended its MC AT series of professional thin film chip resistors to include devices in the 0402, 0603, 0805, and 1206 case sizes.

13 Apr 2010

STATS ChipPAC Expands eWLB Technology to Reconstituted 300mm Wafers

STATS ChipPAC Ltd., a leading semiconductor test and advanced packaging service provider, today announced that it has expanded the embedded Wafer-Level Ball Grid Array (eWLB) technology to reconstituted 300mm wafers.

13 Apr 2010

China Electronics Fair Features Touch Sensitive MP-4 Players Enabled by Carbon Nanotube TCF

Unidym, a majority owned subsidiary of Arrowhead Research Corporation (NASDAQ:ARWR), announced today that touch sensitive MP-4 players enabled by Unidym's transparent conductive films were displayed at the 75th China Electronics Fair.

13 Apr 2010

Cadence Increases Tool Support in TSMC's 65nm Integrated Signoff Flow

Cadence Design Systems, Inc., the leader in global electronic design innovation, today announced that it increases tool support in TSMC's 65-nanometer Integrated Signoff Flow by introducing RTL Compiler, EDI System, QRC Extraction and Encounter Timing System for Signal Integrity into it.

From TSMC Taiwan Semiconductor Manufacturing Company 13 Apr 2010

Synopsys Announces Best Paper Awards at San Jose Conference

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the Best Paper Awards for the twentieth annual Synopsys Users' Group (SNUG®) San Jose conference, held in Santa Clara, Calif. on March 29-31.

From Synopsys, Inc. 13 Apr 2010

Winbond Ramps Up Production of 90nm SpiFlash Memories

Winbond Electronics Corporation, a leading global supplier of Serial Flash and inventor of the popular Multi-I/O Serial Flash architecture, today announced it has reached a significant industry milestone – the company has shipped more than one billion SpiFlash® memories.

13 Apr 2010

SPP Process Shipped Broad Range of Etch, CVD, and PVD Single Wafer Tools in Q1 2010

SPP Process Technology Systems Ltd. (SPTS), a subsidiary of Sumitomo Precision Products Co., Ltd. (SPP), today announced shipments of $40 million during the first quarter of 2010 (ending 31 March).

12 Apr 2010