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ACME's EMP 370, 390 Portable Platforms Support Xeon 32-nm 5600 Series CPUs

Microchip Technology Announces EEPROM Devices in WLCSP and TO-92 Packages

TSMC Selects Quartz DRC and Quartz LVS Verify Integrated Sign-Off Flow

Analog FastSPICE Platform Qualifies for 28nm LP Technology

Analog FastSPICE Platform Qualifies for 28nm LP Technology

Innovative Ideas of Thin-Film Memories to be Highlighted at Leti Workshop

Innovative Ideas of Thin-Film Memories to be Highlighted at Leti Workshop

NanoSemiconductor Company Kopin Releases New Eyepiece Products for Thermal Imaging

NanoSemiconductor Company Kopin Releases New Eyepiece Products for Thermal Imaging

Ciranova’s Helix Technology Supports CSR’s Sub-65nm SoC Design

Ciranova’s Helix Technology Supports CSR’s Sub-65nm SoC Design

Dow Corning Signs Contract with imec to Perform Solar Cell Research

TSMC's EDA Technology Now Available for 65nm, 40nm and 28nm Process Nodes

Plastics Could Replace Expensive Metals Used in Flexible Displays

Plastics Could Replace Expensive Metals Used in Flexible Displays

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