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Micromachined Piezoelectric Harvester with Record Power Output Drives Fully Autonomous Wireless Sensor

For the first time, a piezoelectric harvesting device fabricated by MEMS technology generates a record of 85µW electrical power from vibrations. A wafer level packaging method was developed for robustness. The pack...

From IMEC 8 Dec 2009

Device Accurately Analyzes Nanometer-Scale Effects for Pre-Layout and Post-Layout RF Circuits

Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform, today announced Analog FastSPICE RF (AFS RF), the industry's first true SPICE accurate device noise ana...

8 Dec 2009

Significant Advances in Emerging Memory Technologies, Energy Efficient Devices and High Mobility Channel Transistors

Senior technologists, executives, and faculty from across the semiconductor R+D community presented technical data revealing significant advances in emerging memory technologies, energy efficient devices and high mobilit...

8 Dec 2009

New Efficient Transistor Could One Day Power Laptops and Cars

A Cornell researcher has created an extremely efficient transistor made from a material that may soon replace silicon as king of semiconductors for power applications.

8 Dec 2009

Essensium Joins Wavenis Open Standard Alliance

Essensium N.V., a fabless provider of low power Systemon- Chip (SOC) solutions, today announced it has joined the Wavenis Open Standard Alliance (Wavenis-OSA), as a Participating Member, enabling them to positively influence the voting committees as the first semiconductor member, all the while continuing its partnership with Coronis S.A.S. to complete Coronis' first Wavenis compliant SOC.

8 Dec 2009

Joint Nanotechnology Workshop Designed to Build New Research Partnerships

The College of Nanoscale Science and Engineering ("CNSE") of the University at Albany will host a first-ever conference this week that is designed to enable strategic partnerships with several leading Japanese ...

8 Dec 2009

STMicroelectronics Selected Applied Materials' HKMG Technology for Production of 28nm Logic Devices

Applied Materials, Inc. announced today that STMicroelectronics (ST), a leading semiconductor manufacturer, has selected Applied Materials’ high-k/metal gate (HKMG) technology for the production of its 28nm logic devices.

From STMicroelectronics 8 Dec 2009

Cadence Enables Aggressive Leap from 90nm to 40nm Technology

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced that Applied Micro Circuits Corporation (NASDAQ: AMCC) has selected the Cadence® Encounter® Digital ...

From Cadence Design Systems 8 Dec 2009

Applied Materials to Host Symposium Exploring Sub-22nm Flash Memory

On December 8, in Baltimore, Maryland, Applied Materials will host an important symposium exploring critical questions surrounding the industry’s capability to deliver the density and performance required to satisfy the ever-growing demand for higher capacity flash memory chips.

From Applied Materials Inc. 8 Dec 2009

Researchers Making the Case for Using Exotic Materials to Help Microchips Keep Improving

The huge increases in the power and capacity of computers, cell phones and communications networks in the last 40 years have been the result of ever-shrinking silicon transistors. But silicon transistors are now getting so small that they're running up against fundamental physical limits: soon, it will be impossible to squeeze any better performance out of them.

8 Dec 2009