Nanoelectronics News

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SEMATECH Selects Okamoto's GDM300 Backgrinder for Processing Through Silicon Via

The System, a High-Precision wafer thinning tool, will be installed in SEMATECH's 3D R and D Center at the College of Nanoscale Science and Engineering's (CNSE) world-class Albany NanoTech Complex.

17 Sep 2009

Researchers Receives NSF Grant to Pursue Molecular Spintronics

Researchers at North Carolina State University have received a three-year, $1.2 million grant from the National Science Foundation's Center for Chemical Innovation (NSF-CCI) to pursue research in the emerging field o...

16 Sep 2009

Study Helps Overcome a Long-Standing Challenge in Nanotechnology

College football fans cheer when marching bands spell out the home team's name in gigantic letters on the field at halftime. Now scientists in Utah are reporting the ultimate in one-upmanship: Development of a new technology for writing the school name in letters so small that 500 would fit across the diameter of a human hair (or hundreds of thousands would fit inside the diameter of a human hair).

16 Sep 2009

Researcher for First Time Made Graphene Visible on Gallium Arsenide

PTB has for the first time made graphene visible on gallium arsenide - A successful combination of two unique electronic materials.

16 Sep 2009

MIT Team Finds Way to Combine Materials for Semiconductor Manufacture

For decades, researchers have been trying to combine semiconductor materials that have different and potentially complementary characteristics into a single microchip. Now, an MIT team has finally succeeded in this effort, an advance that could point to a way of overcoming fundamental barriers of size and speed facing today's silicon chips.

15 Sep 2009

Nanoscale Friction and Manipulation of Carbon Nanotubes

Nanotubes and nanowires are promising building blocks for future integrated nanoelectronic and photonic circuits, nanosensors, interconnects and electro-mechanical nanodevices. But some fundamental issues remain to be resolved - among them, how to position and manipulate the tiny tubes.

15 Sep 2009

AIXTRON Receives Order for MOCVD tool from Nanjing University

AIXTRON AG announced today an order for a new MOCVD tool from Nanjing University's Institute of Optoelectronics (IOE) at Yangzhou. The order is a single AIX 2400G3 HT MOCVD system for development of ultra-high-brightness (UHB) InGaN/GaN-based LEDs and has been delivered in the first half of 2009.

From AIXTRON SE 15 Sep 2009

Size isn't the Only Thing that Matters for Data Storage

Molecules of hydrogen are difficult to steer with electric fields because of the symmetrical way that charges are distributed within them. But now researchers at ETH Zurich have found a clever technique to get a grip on the molecules. Their findings are reported in Physical Review Letters and highlighted in the September 14 issue of Physics.

14 Sep 2009

TSMC Adopts Synopsys' HSIM Simulator for Sub-40-Nanometer Memory IP Characterization Flow

Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that TSMC has adopted Synopsys' HSIM® hierarchical FastSPICE circuit simu...

From TSMC Taiwan Semiconductor Manufacturing Company 14 Sep 2009

Carl Zeiss Introduces Next Generation AIMS Mask Qualification System

At the Photomask Technology Conference 2009 in Monterey/CA Carl Zeiss introduces the next generation of their actinic AIMS™ mask qualification system. AIMS™ 32-193i emulates the imaging of photomasks with leading-edge 193nm immersion scanners for the 32nm node and beyond. The first delivery to a leading edge customer is scheduled for September 2009.

From Carl Zeiss Microscopy GmbH 14 Sep 2009