3D Integration and Advanced Lithography Challenges Discussed in SUSS MicroTec Japan Seminar

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, hosted the SUSS MicroTec Japan Seminar 2012 on December 4, at the Hyatt Regency Tokyo. In two parallel tracks the latest developments in 3D Integration and Next Generation Lithography as 193i, EUVL and NIL were presented and discussed. Both seminars attracted approximately 200 attendees.

The very well attended seminar on 3D Integration addressed the latest developments in 2.5D/3D Packaging. Industry leading companies and market research institutes like Yole Développement shared their views on the technology road map and on the 3DIC market for high performance computer & server networks, smartphones and tablets. These applications have been identified as today's major market drivers.

The Next Generation Lithography (NGL) seminar focused on advances in mask manufacturing technologies. The industry still faces significant challenges for EUVL pilot lines and their future introduction to high volume manufacturing. This Session spot-lighted on EUVL challenges including critical processes from the mask prospective. In addition, the session touched on other lithography solutions such as 193i extension, Nano Imprint Lithography and Direct Self Assembly (DSA).

'On one hand Moore's Law is demanding further shrinking and drives EUVL as well as alternative lithography technologies, but on the other hand 2.5D/3D Integration gains importance and is in the strategic focus of many global players. We hosted this Seminar to present our solutions on both sides and to discuss remaining technological challenges with customers and cooperation partners', says Frank P. Averdung, President and CEO of SUSS MicroTec. 'We presented our solutions for thin wafer handling, wafer bonding and our leading mask processing technology. We also introduced new technological capabilities, such as Tamarack's UV-Projection Lithography and Laser Processing Technology.'

The Forum on 3D Integration featured representatives from the Industrial Technology Research Institute (ITRI), Yole Développement, Interconnection Technologies, Fujitsu, Tokyo University, Thin Materials AG, Brewer Science, D-Process, Toray Engineering, Cookson Electronics and Electroplating Engineers of Japan (EEJA). The Next Generation Lithography Session featured representatives from Toshiba, Dai Nippon Printing, Toppan Printing, Gigaphoton, FUJIFILM, Asahi Glass, Nuflare Technology and Molecular Imprint.

Source: http://www.suss.com

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