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TSMC Adopts Synopsys Tools and IP for 28-nm Process Technology

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it is delivering comprehensive design enablement for TSMC's 28-nanometer (nm) process technology with TSMC Reference Flow 11.0.

New features of the flow include solutions for system-level design and verification, added capabilities for 28-nm design, including In-Design physical verification, and support for thru-silicon via (TSV) technology for 3D IC design. Through Reference Flow 11.0, Synopsys tools and IP enable enhanced productivity, lower power, higher yield and increased performance and integration.

"TSMC and Synopsys have a long history of collaboration on the TSMC Reference Flow," said ST Juang, senior director of design infrastructure marketing at TSMC. "The combination of Synopsys tools and IP with our 28-nanometer design methodology and process technology in Reference Flow 11.0 provides engineers with comprehensive solutions that address manufacturability while enabling design for optimal performance and power consumption. The new technologies in this flow, such as thru-silicon-via and system-level design, bring a new level of advancement to what we offer our mutual customers."

Synopsys has extended Reference Flow 11.0 to support system-to-RTL design and verification. The addition of DesignWare® synthesizable and verification IP solutions for on-chip interconnect fabric, as well as peripheral devices, enables designers to rapidly assemble systems around the AMBA® protocol. Synopsys' Innovator virtual platform tool and the DesignWare System-Level Library models provide an integrated development environment for system on chip (SoC) developers to efficiently create and debug virtual prototypes months before hardware is available, accelerating the delivery of products to market. The system-level solution in Reference Flow 11.0 is connected to RTL through VCS® through VMM methodology, enabling ESL testbenches and IP to be created for virtual prototypes, then reused with SystemVerilog, Verilog or VDHL.

Synopsys Galaxy™ Implementation Platform features complete support for TSMC's latest set of 28-nm design rules in IC Compiler place and route, IC Validator physical verification, and Star-RC parasitic extraction. In-Design Physical Verification with IC Validator is a key new capability in Galaxy, enabling enhanced manufacturing-compliance and accelerated time-to-tapeout. In-Design Physical Verification successfully avoids late-stage surprises common at advanced nodes like 28-nm, by enabling IC Compiler users to do verification during physical design, assuring a manufacturing-clean design at signoff. Automatic DRC Repair enabled by the IC Compiler, IC Validator combination provides an order of magnitude improvement over manual fixing of late-stage DRC errors.

The Eclypse™ Low Power Solution includes enhanced hierarchical low power flow support with the IEEE 1801™ (UPF) standard. Additionally, the implementation platform now offers power management and power constraint rules. VCS with MVSIM and MVRC provide accurate simulation and static verification of designs with multi-rail macros, analog IP blocks and designs with complex power control architectures.

The addition of TSV support for 3D IC design to Reference Flow 11.0  provides emerging technology that complements conventional transistor scaling, allowing multiple silicon dice to be stacked and integrated in a single package. Synopsys has collaborated with TSMC in establishing a 3D stacked IC design flow that supports the vertical integration of multiple silicon dice through all stages of design, implementation, analysis and signoff.

"We've worked closely with TSMC to ensure that our design and verification platforms, as well as our low power and manufacturing compliance technologies address complex design requirements," said Rich Goldman, vice president of corporate marketing and strategic alliances at Synopsys. "The integration of enhanced system-level design and verification capabilities, IP and 3D IC technology offers our mutual customers an optimized path to achieve their 28-nanometer SoC design goals."



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