Business Leaders to Discuss MEMS Integration into Electronic Products

8.58 billion MEMS devices generating nearly $10B in revenue will ship in 2014, according to leading microelectromechanical systems (MEMS) market analysts.

Accelerometers, gyroscopes, MEMS microphones and pressure sensors are already shipping by the hundreds of millions, and energy harvesters, microfuel cells and RFID are just a few of the emerging market areas in which MEMS will play over the next five years. What is driving all this growth in MEMS? At MEMS Executive Congress, to be held November 3-5 in Scottsdale, AZ, business leaders from the entire MEMS supply chain will join OEMs to examine how MEMS’ integration with other electronic components is enabling new levels of intelligence, interactivity and performance in wide-ranging system solutions.

Vida Ilderem, PhD, vice president of Intel Labs and director of the Integrated Platform Research Lab for Intel Corporation, will deliver a keynote address on deep integration using highly integrated platform-on-chip architectures as well as digital, analog and physical design factors: "Usage models and user interaction along with emerging innovative applications are resulting in sensors and actuators becoming an integral part of the mobile market, from handheld to health to embedded. The industry challenge will be to deliver a cost-effective integrated solution.”

During his keynote, Rich Duncombe, PhD, HP strategist, Technology Development Organization, Imaging and Printing Group, Hewlett-Packard Company, will address MEMS as a core enabling technology and its role within the next wave of computing that connects everything including ever-expanding sensor networks: “Hewlett-Packard has created a new level of sensing technology that is about 1,000 times more sensitive than accelerometers used in many current game controllers or smart phones. When used in a wireless sensing system, the device can enable real-time data capture and analysis to create a new level of awareness,” offered Duncombe. “Its first application is a wireless seismic sensing system designed to acquire high-resolution seismic data.” Duncombe elaborated: “The new high-resolution system, developed in partnership with Shell, will vastly improve the quality of seismic imaging, allowing Shell to more easily and cost-effectively investigate oil and gas reservoirs.”

“As our signature event, MEMS Executive Congress is an intimate two-day forum at which companies that make and use MEMS technology gather to explore the most compelling topics of the day,” said Karen Lightman, managing director of MEMS Industry Group. “The Congress is focused on the business of MEMS—and for a sixth year, we will feature keynote speakers and panelists from a wide spectrum of international OEMs who have made the smart decision to integrate MEMS into their products.”

MEMS Executive Congress 2010 Panels

  • Smart and Clean Energy: MEMS in Energy Exploration and Production—will explore exciting developments for MEMS in the world of energy production and storage. Moderated by André Rouzaud, PhD, deputy vice president of microsystems and heterogeneous integration on silicon, CEA-Leti, with panelists:
    • Cleo Cabuz, PhD, CTO, Life Safety, Honeywell;
    • Liji Huang, president, CEO and co-founder, Siargo; and
    • Dean Samara-Rubio, PhD, platform architect, Energy and Utilities, Intel.
  • Robotics & Intelligent Healthcare Products: Improving Quality of Life with MEMS—will identify new lifesaving and life-enhancing robotics and intelligent health products that require a high degree of interactivity with the environment—and can deliver it in a small package. Moderated by Harry Stephanou, PhD, director, Automation & Robotics Research Institute (ARRI), with panelists:
    • Mark Diperri, Human Machine Integration expert, Freescale Semiconductor;
    • David Doherty, head of business development, 3G Doctor;
    • Jack McCauley, consultant and lead designer of games such as Wii Fit 2.0 for Nike/Nintendo;
    • Isao Shimoyama, PhD, Graduate School of Information Science and Technology, University of Tokyo; and
    • Dan Siewiorek, PhD, Buhl University professor of computer science and electrical and computer engineering, Carnegie Mellon University.
  • Next-Generation Mobile Consumer MEMS—will examine the ways in which MEMS in consumer electronics has radically changed the way society experiences mobile devices, with an eye toward new opportunities for consumer MEMS in other markets. Moderated by Frank Melzer, PhD, CEO, Bosch Sensortec GmbH, with panelists:
    • Michael Fritts, vice president, sales, marketing & business development, Microvision;
    • Jungkee Lee, PhD, principal engineer, Next Generation Technologies, Samsung;
    • Takeo Oita, fellow, Nihon Dempa Kogyo Co., Ltd. (NDK); and
    • Greg Turetzky, senior marketing director, CSR.
  • MEMS Market Analyst Panel—will feature analysts from leading research firms presenting their outlook on future growth and trends in MEMS. Moderated by Steven Dwyer, vice president & general manager, EV Group, with panelists:
    • Jérémie Bouchaud, principal analyst, MEMS, iSuppli;
    • Jean-Christophe "JC" Eloy, president & CEO, Yole Développement;
    • Roger Grace, president, Roger Grace Associates; and
    • Robert Lensch, managing director, Boucher-Lensch Associates LLC.


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