Nov 26 2010
FSI International, Inc. (Nasdaq: FSII), a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that it shipped its FSI ORION® single wafer processing system to another leading Asian semiconductor manufacturing customer.
The qualification system will be used in ashless all-wet photoresist strip and wet metal etch applications for the development and production of memory devices. Revenues from shipments of production use systems for this customer are expected to begin in the second half of 2011.
Unique among single wafer processing tools, the closed chamber design of the FSI ORION system effectively contains process chemicals, permitting the use of the aggressive, high-temperature sulfuric peroxide mixture (SPM) chemistry of the ViPR™ process. Standard SPM chemistries are unable to completely strip photoresists exposed to higher levels of ion implantation unless first subjected to a plasma ashing step. The ViPR process effectively strips in one step by wet chemical action alone, providing both manufacturing cycle time and lower operating cost benefits to the customer. Additionally, the ViPR process removes resists while preserving the customer’s device materials such as silicon nitride achieving silicon nitride losses as low as 0.1 nanometer.
Source: http://www.fsi-intl.com/