Korean Memory Manufacturer Selects Nanometrics Unifire Metrology System

Nanometrics Incorporated (Nasdaq: NANO), a leading provider of advanced process control metrology systems, today announced that a major Korean memory manufacturer has accepted its UniFire 7900 metrology system for process control of advanced packaging of DRAM devices.

The metrology tool will be used in development of through-silicon via (TSV) technology, projected to be a key enabling feature of next generation DRAM designs. With this placement, the UniFire system has now been adopted by four of the top seven semiconductor manufacturers worldwide.

The UniFire tool offers customers a broad range of features to control their micro bump, redistribution layer(s), and TSV patterning, etch and deposition processes, including measurement of critical dimensions (CD), registration, and depth/height/profile, as well as the ability to measure wafer bow/shape and film thickness.

"High precision measurements of TSV, micro bump, and redistribution processes are critical to enable high-yield DRAM devices for next generation wafer scale packaging," said Dr. Michael Darwin, Vice President of the UniFire and Materials Characterization Groups at Nanometrics. "The UniFire offers a unique, non destructive, 3D metrology capability allowing full surface topography control while reducing the need for multiple, independent metrology tools. This capability makes it an indispensable tool to ensure a higher yielding and quality manufacturing process with reduced cost of ownership."

According to market research company Yole Developpement, the overall market for 3D IC related equipment is projected to grow significantly in total revenue over the next five years with a CAGR of more than 60%. The growth will be mainly driven by the emergence of 3D TSV stacked memories, wide I/O interface in logic ICs as well as MEMS, CMOS image sensors and other 3D stacking applications.

"Our UniFire system continues to show promise as it is adopted by market leaders and proven to be a powerful and versatile tool," said Dr. Timothy J. Stultz, president and chief executive officer. "The UniFire's application in process control for wafer scale packaging applications meaningfully expands our served markets and opportunity for business growth."

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