Checkpoint Technologies, a provider of laser scanning and photon emission microscopy systems for applications in the failure analysis industry, has unveiled its 3.0 numerical aperture (NA) solid immersion lens objective (SIL).
In the failure analysis industry, this advanced 3.0 NA SIL technology will be used to fulfill customer requirements for optically debugging ICs at 22 nm. Checkpoint Technologies offers this innovative technology for its InfraScan laser scanning systems, including the InfraScan LTM, the InfraScan 300 TDE and the InfraScan 300 ES. These InfraScan laser scanning systems offer high-quality imaging for laser timing, photon emission and laser scanning applications and optically debugging ICs.
Checkpoint Technologies is a supplier of laser scanning instruments to the semiconductor market for identifying defects in IC devices in order to optimize their dependability and speed. The InfraScan laser scanning microscopy system product line offers advanced design and high consistency, with virtually nil downtime for optically debugging ICs, photon emission microscopy and laser voltage probing.
The Director of Sales and Marketing at Checkpoint Technologies, Michael Jupina stated that since ICs dimensions reduce to 28 nm and below, the requirement for silicon circuitry’s near infrared resolution through the die’s rear side can only be achieved using the SIL technology. Jupina added that the company is the major solution provider in near-infrared imaging for debugging of ICs for laser timing applications.
Source: http://www.checkpointtechnologies.com