Posted in | Nanofabrication

UMC Secures License for IBM’s 20 nm Process Design Technology

United Microelectronics has licensed IBM’s technology for the development of UMC’s 20 nm CMOS process employing FinFET 3D transistors. The licensed technology is expected to hasten the delivery of the next generation 20 nm process to UMC’s customers.

Dr. IC Chen, Vice President, Advanced Technology Development, UMC, stated that liaising with a leading technology provider such as IBM would help consolidate UMC’s market position as a semiconductor foundry by facilitating timely inception of next generation technology that would aid in the development of advanced integrated circuits. He also pointed out the significant reduction in time in the R&D cycle. The 20 nm planar process developed by UMC will be in sync with the device targets and design rules of IBM. The FinFET from UMC will be available for communication and mobile computing applications as a low power enhancement. The processes will be implemented at UMC’s Taiwan R&D facility at Tainan.

United Microelectronics is a renowned global semiconductor foundry which delivers sophisticated technology and production services for a wide range of applications, covering all the key sectors of the IC industry. The company has 10 wafer manufacturing facilities. These include two 300 mm fabrication facilities, viz. the Fab 12i at Singapore and the Fab 12A in Taiwan. With employee strength of over 14,000, the company has offices worldwide at Taiwan, Singapore, Japan, United States and Europe.


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