Posted in | News | MEMS - NEMS

New Research Report Analyzes Avago FBAR Filter All-Silicon MEMS Duplexer

Research and Markets has announced the addition of the "Avago FBAR Filter All-Silicon MEMS Duplexer Reverse Costing Analysis" report to their offering.

The highest volume production MEMS using TSV Technology based on AlN piezoelectric active layer

With more than 1 Billion units produced per year and a market share of 65%, Avago Technologies clearly dominates the BAW filter market. The ACMD-7612 is an UMTS Duplexer manufactured with Avago's film bulk acoustic resonator (FBAR) technology which uses AlN piezoelectric material for resonating layers.

The filters are hermetically wafer-level packaged with Avago's Microcap bonded-wafer CSP technology, allowing the filters to be assembled in a molded chip-on-board module of less than 1.2 mm high.

TSVs are etched in the cap in order to report electrical contacts and thus reduce filter dies size.

The ACMD-7612 is targeted for handsets or data terminals operating in the UMTS Band I frequency range and features a Maximum RF Input Power to Tx Port of ±33 dBm.

This report provides complete tear-down of the FBAR duplexer with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow (including AlN process, wafer capping and TSV manufacturing)
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation

Key Topics Covered:

Glossary

Overview/Introduction

Company Profile

Physical Analysis

  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package X-Ray
  • Package Opening - Main Parts
  • Package Cross-Section
  • MEMS Dies Dimensions
  • MEMS Dies Markings
  • MEMS Dies Bond Pads & TSV
  • Tx Die Opening
  • Tx Die Cap
  • Tx Die FBAR
  • Rx Die Opening
  • MEMS Die Cross-section - Overview
  • MEMS Die Cross-section - TSV
  • MEMS Die Cross-section - Membrane
  • MEMS Die Cross-section - Contacts

Manufacturing Process Flow

  • Global Overview
  • MEMS Process Overview
  • FBAR Process Flow
  • Cap Process Flow
  • Wafer Bonding Process Flow
  • Description of the Wafer Fabrication Unit
  • Component Packaging Process Flow

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Yields Explanation
  • Yields Hypotheses
  • Dies per wafer & Probe Test
  • MEMS Front-End Cost
  • MEMS Front-End cost per Process Steps
  • Back-End 0: Probe Test & Dicing Cost
  • MEMS Dies Cost
  • Back-End: Packaging Cost
  • Back-End: Packaging Cost per steps
  • Back-End: Final test Cost
  • ACMD-7612 Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

Source: http://www.researchandmarkets.com

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Research and Markets. (2019, February 11). New Research Report Analyzes Avago FBAR Filter All-Silicon MEMS Duplexer. AZoNano. Retrieved on May 25, 2024 from https://www.azonano.com/news.aspx?newsID=26634.

  • MLA

    Research and Markets. "New Research Report Analyzes Avago FBAR Filter All-Silicon MEMS Duplexer". AZoNano. 25 May 2024. <https://www.azonano.com/news.aspx?newsID=26634>.

  • Chicago

    Research and Markets. "New Research Report Analyzes Avago FBAR Filter All-Silicon MEMS Duplexer". AZoNano. https://www.azonano.com/news.aspx?newsID=26634. (accessed May 25, 2024).

  • Harvard

    Research and Markets. 2019. New Research Report Analyzes Avago FBAR Filter All-Silicon MEMS Duplexer. AZoNano, viewed 25 May 2024, https://www.azonano.com/news.aspx?newsID=26634.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.