Posted in | MEMS - NEMS

New Research Report Analyzes Avago FBAR Filter All-Silicon MEMS Duplexer

Research and Markets has announced the addition of the "Avago FBAR Filter All-Silicon MEMS Duplexer Reverse Costing Analysis" report to their offering.

The highest volume production MEMS using TSV Technology based on AlN piezoelectric active layer

With more than 1 Billion units produced per year and a market share of 65%, Avago Technologies clearly dominates the BAW filter market. The ACMD-7612 is an UMTS Duplexer manufactured with Avago's film bulk acoustic resonator (FBAR) technology which uses AlN piezoelectric material for resonating layers.

The filters are hermetically wafer-level packaged with Avago's Microcap bonded-wafer CSP technology, allowing the filters to be assembled in a molded chip-on-board module of less than 1.2 mm high.

TSVs are etched in the cap in order to report electrical contacts and thus reduce filter dies size.

The ACMD-7612 is targeted for handsets or data terminals operating in the UMTS Band I frequency range and features a Maximum RF Input Power to Tx Port of ±33 dBm.

This report provides complete tear-down of the FBAR duplexer with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow (including AlN process, wafer capping and TSV manufacturing)
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation

Key Topics Covered:



Company Profile

Physical Analysis

  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package X-Ray
  • Package Opening - Main Parts
  • Package Cross-Section
  • MEMS Dies Dimensions
  • MEMS Dies Markings
  • MEMS Dies Bond Pads & TSV
  • Tx Die Opening
  • Tx Die Cap
  • Tx Die FBAR
  • Rx Die Opening
  • MEMS Die Cross-section - Overview
  • MEMS Die Cross-section - TSV
  • MEMS Die Cross-section - Membrane
  • MEMS Die Cross-section - Contacts

Manufacturing Process Flow

  • Global Overview
  • MEMS Process Overview
  • FBAR Process Flow
  • Cap Process Flow
  • Wafer Bonding Process Flow
  • Description of the Wafer Fabrication Unit
  • Component Packaging Process Flow

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Yields Explanation
  • Yields Hypotheses
  • Dies per wafer & Probe Test
  • MEMS Front-End Cost
  • MEMS Front-End cost per Process Steps
  • Back-End 0: Probe Test & Dicing Cost
  • MEMS Dies Cost
  • Back-End: Packaging Cost
  • Back-End: Packaging Cost per steps
  • Back-End: Final test Cost
  • ACMD-7612 Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis


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