Jun 13 2014
ITT Corporation and its Cannon brand interconnect systems have a long legacy of equipping defense forces with innovative, high-reliability connector technologies. Today, these systems are lighter, smaller, sealed and ruggedized versions of our standard high-reliability connectors that offer an increasing number of benefits for soldier-worn applications.
With faster high-speed data and RF connections, these new connector systems are designed to work with smaller Micro and Nano wire sizes that minimize weight and maximize performance and reliability. They also can be used with the latest fabrics in low- and no-profile configurations that minimize their presence to the soldiers wearing them.
Delivering reliable power and more mission-critical data in a lightweight, robust and integrated package helps lighten soldiers’ physical loads and helps them maintain contact and receive crucial information.
Next week, ITT and its Cannon brand will highlight their comprehensive array of mission critical applications for soldiers – including weapons control, biosensors, threat location, GPS, radio communications, thermal imaging and battery power – at Eurosatory, the premier global defense and security show being held in Paris June 16-20.
These latest connector solutions feature super clean pull-back barrel cleaning systems, space saver “no profile” designs, rugged stainless steel construction, pogo pad technology that eliminates the need for dust caps, pogo contact technology that delivers increased durability with more than 10,000 cycles, and canted spring technology featuring snap-on and break-away coupling technology with 360-degree EMI protection.
“ITT and our Cannon team are committed to connecting and protecting soldiers today and in the future by developing advanced technologies for critical defense-related harsh environment applications,” said Neil Yeargin, president of ITT’s Interconnect Solutions business. “Our rugged connector solutions offer conductivity, flexibility and safety in increasingly smaller and lighter form factors. We will continue to focus our engineering on solutions that help enhance safety and power the most important mission critical technologies.”
At Eurosatory, Cannon will showcase the Nemesis mini-connector line for the soldier wearable market. The Nemesis Space Saver and Nemesis Super Clean versions deliver enhanced connectivity and safety in a smaller, lightweight and easy-to-clean design architecture. Available in versions with extra seals and lower profile, the connectors can be conveniently embedded into clothing and are ideal for use with sensors and other bidirectional location service applications.
The Nano D line of rectangular connectors offers one of the smallest packages available on the market today. The Nano series is engineered to channel events into a single pipe, offering more efficient fiber optics communications. Nano D is ideally suited to handle high-bandwidth data in harsh environments and offer flexibility in either wearable or board-mountable applications.
“Our connector solutions are engineered to be the lightweight, reliable and durable so soldiers can focus on their missions,” said Wes Morgan, director of product management for ITT’s Interconnect Solutions business. “We are proud to transform and power modern defense forces with connectors offering improved conductivity, smaller form factors, reduced weight and highly engineered construction with corrosion resistant materials.”
Cannon is also showcasing its Universal Contact connectors enabling high-reliability contacts for power data and RF; Micro RF connectors ideal for high-bandwidth data and RF applications in a micro size; Nemesis micro circular connectors with unique pull back break-away coupling systems with pogo pad contacts for easy cleaning; Micro and Nano-D rectangular connectors ideal for PCB and panel mount integration; and the comprehensive MKJ series of circular interconnects with crimp and poke field terminated contacts with multiple coupling styles including ratcheting threaded versions and breakaway styles.
Source: http://www.itt.com/