Visit LatticeGear- Booth 86 (Nano Technology Solutions)
At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.